Mellanox Technologies, Ltd.

Ayal Shabtay

Jamal Mousa

Alon Rokach

Kfir Katz

Nimer Hazin

Oren Weltsch

Aziz Mazbar

Beeri Halachmi

Rom Becker

Bar Noyman

Nimer Khazen

Yaniv Kazav

Tom David

David Fischer

Yogev Buzaglo

Shay Zaretsky

Yuval Blayer

Michal Shlomai

Yuval Dagan

Yuval Ullman

A transceiver includes, (a) a communication circuit, which is configured to exchange signals between a cable and a communication unit when the transceiver is connected to the communication unit, and (b) a housing, including: (i) a first shell including a substrate having the communication circuit disposed thereon, (ii) a second shell, which is configured to connect with the first shell for encapsulating the communication circuit, the second shell has an opening facing the communication circuit, and (iii) a base plate, which is fitted in the opening and including a first surface having one or more cooling fins formed thereon, and a second surface, opposite the first surface that is facing the communication circuit, the base plate is configured to transfer heat between the communication circuit and the cooling fins.

Mechanical thermal interface for improved heat dissipation in network transceivers

A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.

Network interface device having heat dissipating members

A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Device with integrated liquid cooling system

A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

Mechanical device for cooling an electronic component

A bi-directional fan device that is field replaceable within an electronic system is provided. The bi-directional fan device includes a fan unit that cools an electronic system when connected to a power source, and an electrical connector constructed at both ends of the fan unit to electrically connect to the power source.

Bi-directional fan

Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions of the top cage member, and the bottom cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the bottom cage member, and the heat dissipation unit includes one or more heat dissipation elements allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.

Cage receptacle assembly with heat dissipation units

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Haifa, Israel

Ayal Shabtay