Kabushiki Kaisha Toshiba

Ayako Mizuno

Makiko Katano

Yuji Yamada

Katsuya Okumura

Hiroshi Tomita

Takuya Kono

Chikashi Takeuchi

Eri Uemura

Asuka Uchinuno

A metal collection solution according to an embodiment contains 48 wt % or more of HNO, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.

Metal collection solution and method of analyzing substrate contamination

A sample contamination method according to an embodiment includes spraying a chemical solution containing contaminants into a casing, carrying a semiconductor substrate into the casing filled with the chemical solution by the spraying, leaving the semiconductor substrate in the casing filled with the chemical solution for a predetermined time, and carrying the semiconductor substrate out of the casing after the predetermined time passes.

Sample contamination method

An immersion lithography apparatus includes: a projection optical system which projects a pattern of a mask onto a substrate; a substrate cleaning unit which cleans the substrate prior to projection of the pattern; a liquid supply mechanism which supplies the same liquid to an immersion region between the projection optical system and the substrate and to the substrate cleaning unit; a first liquid discharge path through which the liquid discharged from the immersion region is passed; and a second liquid discharge path through which the liquid discharged from the substrate cleaning unit is passed.

Immersion lithography apparatus and exposure method

A semiconductor manufacturing system, having a filter that is disposed in a clean room and removes an organic solvent containing siloxane from a gas supplied from the outside of said clean room; a first semiconductor manufacturing apparatus that is disposed in said clean room and uses light in an atmosphere containing the gas having passed through said filter; a second semiconductor manufacturing apparatus that is disposed in said clean room and has an exhaust gas outlet for discharging a gas containing an organic solvent containing siloxane; and a removing device that is disposed at said exhaust gas outlet of said second semiconductor manufacturing apparatus, filters out the organic solvent containing siloxane from the exhaust gas output from said exhaust gas outlet, and discharges the filtered gas into an exhaust gas duct for discharging the exhaust gas to the outside of said clean room.

Semiconductor manufacturing system and method of manufacturing semiconductor device

A method of maintaining cleanliness of substrates including a first step for accommodating at least a piece of substrate having a gaseous impurity-trapping filter arranged close thereto in a hermetically sealed box, and a second step for circulating the atmosphere in the box at a rate of two or more times a minute so that impurities in the atmosphere are adsorbed by the gaseous impurity-trapping filter. A box for accommodating substrates includes a housing in which space for accommodating the substrates is hermetically closed with a lid, a gaseous impurity-trapping filter arranged in the housing and adapted to adsorb impurities contained in the atmosphere in space, and an atmosphere-circulating device having a ratio of the circulating capacity to the space volume of not smaller than 2 in order to circulate the atmosphere so as to pass it through the gaseous impurity-trapping filter.

Growing community of inventors

Yokohama, Japan

Ayako Mizuno