Dai Nippon Printing Co., Ltd.

Ayako Furuse

Teppei Sotoda

Ryohei Kasai

Tadashi Furukawa

Ryo Furugen

Tetsushi Hosoda

Katsuya Sakayori

Yoshihiro Kobayashi

Takanori Maeda

Takayuki Ota

Koudai Okada

Keisuke Wakita

Aya Takao

Nahomi Kanazawa

A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150&#xb0; C. to 400&#xb0; C.; and wherein a tensile elastic modulus at 25&#xb0; C. obtained by measuring a 15 mm&#xd7;40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.

Polyimide film, laminate and surface material for display

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Tokyo-to, Japan

Ayako Furuse