Panasonic Intellectual Property Management Co., Ltd.

Ayaka Suzuki

Hiroshi Shibata

Kaoru Sato

Masafumi Matsui

Mutsuhiko Matsumoto

Kaoru Satou

Makoto Sugiyama

Wakana Nogami

Shunji Miyake

A cooling device includes: a heat receiver configured to transfer heat from a heat generation body to a refrigerant, a heat radiator that is connected to the heat receiver via a heat radiation path, and a return path that connects the heat radiator and the heat receiver with each other, in which the refrigerant is to circulate in order of the heat receiver, the heat radiation path, the heat radiator, and the return path and cause a gas-liquid two-phase change and cool the heat generation body, and in which the heat receiver includes a heat receiving plate which is in contact with the heat generation body and is configured to absorb the heat, and a heat receiving cover which covers a surface of the heat receiving plate and defines a heat receiving space.

Cooling device and electronic device using same

A cooling device for cooling a rack-type server of which a housing includes a plurality of electronic devices includes an interior cooling unit and an exterior cooling unit. The interior cooling unit includes a heat-receiving unit, a heat dissipation unit, an outward path pipe, and a return path pipe. The interior cooling unit allows working fluid to be circulated through the heat-receiving unit, the outward path pipe, the heat dissipation unit, the return path pipe, and the heat-receiving unit to thereby move the heat from the heat-receiving unit to the heat dissipation unit. The exterior cooling unit has a heat exchange unit abutted on the heat dissipation unit and allows, by a circulated cooling medium, the heat of the working fluid discharged from the heat dissipation unit to be dissipated to external air.

Cooling device for cooling rack-type server, and data center provided with same

Growing community of inventors

Aichi, Japan

Ayaka Suzuki