Senju Metal Industry Co., Ltd.

Ayaka Shirakawa

Hiroyoshi Kawasaki

Kuniaki Sato

Masato Shiratori

Tomohisa Kawanago

Yasuhiro Kajikawa

Atsumi Takahashi

Daisuke Maruko

Hiroshi Sugii

Provided is a flux that can suppress the generation of voids when an indium alloy sheet is used to perform a continuous reflow under different temperature conditions. The present invention employs a flux that contains a rosin ester, an organic acid (A), and a solvent (S). The organic acid (A) includes a dimer acid (A1) that demonstrates a weight reduction rate of not more than 1 mass % in a thermogravimetric analysis in which the dimer acid is heated up to 260° C. at a temperature rising rate of 10° C./min. The solvent (S) includes a solvent (S1) that demonstrates the weight reduction rate of at least 99 mass % in a thermogravimetric analysis in which the solvent (S1) is heated up to 150° C. at a temperature rising rate of 6° C./min.

Flux and method for producing electronic component

A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.

Flux and solder paste

Growing community of inventors

Tokyo, Japan

Ayaka Shirakawa