Hitachi Chemical Company, Ltd.

Aya Ikeda

Shinjiro Fujii

Sadaaki Katou

Mika Kimura

Syougo Kikuchi

Shu Hashimoto

Sadaaki Kato

A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100&#xb0; C. is 0.031 or less.

Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element

An adhesive composition comprising (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered phenolic compound, (d) a thioether compound and (e) a compound having a thiol group.

Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element

An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.

Growing community of inventors

Tokyo, Japan

Aya Ikeda