Epcos Ag

Tdk Electronics Ag

Axel Pecina

Thomas Feichtinger

Robert Krumphals

Guenter Engel

Gernot Feiel

Günter Engel

Günther Greier

Renate Kofler

Harald Köppel

Zeljko Maric

Thomas Goebel

Rainer Hoermann

Sebastian Brunner

Marion Ottlinger

Oliver Dernovsek

Martin Galler

Harald Kastl

Yongli Wang

Klaus-Dieter Aichholzer

Michael Hirschler

Georg Krenn

Stefan Obermair

Christian Faistauer

Siegfried Fellner

Volker Wischnat

Wolfgang Athenstaedt

Masahiro Oishi

Christian Hesse

Peter Gerletz

Ivan Jagust

Gerhard Bisplinghoff

Gerald Schlauer

Zdravko Mijocevic

Qirong Li

Werner Tschnuchnig

In an embodiment an assembly includes at least one surface mounted device (SMD) component, a metallic wiring configured to lead current from the at least one SMD component to an external circuit and at least one protection element is configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring, wherein the assembly has a structure of a molded module, and wherein the at least one SMD component includes a rechargeable all solid-state battery.

Assembly for protecting an SMD component from environmental influences

A multi-layer component () is specified, comprising a main body () with an external contact () arranged thereon, a further contact () for electrically contacting the multi-layer component (), and a connecting element () for connecting the external contact () and the further contact (), wherein the connecting element () is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact () from the external contact () is brought about.

Multi-layer component having an external contact

A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.

Component carrier and component carrier arrangement

A method for producing an electrical contact is disclosed. In an embodiment the method includes providing a piezoelectric component that includes an electromechanical transducer having two first electrodes and a second electrode arranged between the two first electrodes and spaced from the two first electrodes by a piezoelectric material, the transducer further including a first main side, a second main side opposite from the first main side and a first longitudinal side, and forming a contiguous metallization layer onto a first partial region of the first main side and onto a second partial region along the first longitudinal side, so that the second partial region along the first longitudinal side is at a distance from a side edge facing the second main side and the metallization layer in the second partial region of the first longitudinal side contacts the two first electrodes in an electrically conducting manner.

Method for producing an electrical contact

A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Light-emitting diode device

An electric component assembly comprising a semiconductor component () and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier () by means of the varistor body.

Electronic component assembly comprising a varistor and a semiconductor component

An electric component arrangement is described, comprising a semiconductor component () mounted on a varistor body (). The varistor body is contact-connected to the semiconductor component for the protection thereof against electrostatic discharges and contains a composite material having as matrix a varistor ceramic and as filler a highly thermally conductive material being different from the varistor ceramic.

Electric component assembly

A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.

Multilayer electrical component

A piezoelectric component includes an electromechanical transducer with two first electrodes and a second electrode. The second electrode is arranged between the two first electrodes. The transducer also includes a first main side, a second main side, opposite from the first main side, and a first longitudinal side. A first contiguous metallization layer is arranged on a first partial region of the first main side and on a partial region of the first longitudinal side adjacent to the first partial region of the first main side. Here, the partial region of the first longitudinal side is kept at a sufficient distance from a side edge facing the second main side and the partial region electrically contacts the at least two first electrodes.

Piezoelectric component and method for producing an electrical contact

An electric component arrangement is described, comprising a semiconductor component () and a varistor body (), which is contact-connected to the semiconductor component in order to protect the latter against electrostatic discharges. The semiconductor component and the varistor body are arranged on a common carrier () containing a highly thermally conductive ceramic.

Electronic component arrangement comprising a varistor and a semiconductor component

A method for producing a multilayer component is described. A stack of green foils, to which inner electrodes including palladium oxide are applied, is sintered. The sintered stack is provided with a silver paste on two or more sides for outer electrodes that are burned into the sintered stack in a further temperature step.

Method for producing a multilayer component

An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. An electrically insulating stiffening element is arranged at a distance from at least one electrode layer on the same dielectric layer as the electrode layer. The stiffening element preferably has an increased flexural strength with respect to dielectric material surrounding it.

Electrical multilayer component

An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.

Electric component comprising external electrodes and method for the production of an electric component comprising external electrodes

An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. Electrode layers of identical electrical polarity are jointly contacted to an external contact arranged at a side face of the stack. A resistor sintered to the stack and containing ceramic resistance material is arranged on an end face of the stack.

Electrical multilayer component and method for producing an electrical multilayer component

A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.

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St. Martin, Austria

Axel Pecina