Advanced Micro Devices Corporation

Globalfoundries Inc.

Axel Kiesel

Uwe Stoeckgen

Heiko Wundram

John Lampett

Johannes F Groschopf

A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.

Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet

A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.

Growing community of inventors

Chemnitz, Germany

Axel Kiesel