Robert Boschgmbh

Axel Grosse

Volker Schmitz

Ralf Hausner

Heribert Weber

Jochen Zoellin

Heiko Stahl

Bernhard Gehl

Julian Gonska

Udo Bischof

Lutz Mueller

Holger Hoefer

A method for bonding wafers eutectically, including the steps: (a) providing a first wafer having a first bonding layer and a second wafer having a second bonding layer and a spacer; (b) bringing the first wafer in juxtaposition with the second wafer, the spacer resting against the first bonding layer; (c) pressing the first wafer and the second wafer together, until the first bonding layer and the second bonding layer abut, the spacer penetrating the first bonding layer; (d) bonding the first wafer to the second wafer eutectically, by forming a eutectic alloy of at least parts of the first bonding layer and the second bonding layer. Also described is a eutectically bonded wafer composite and a micromechanical device having such a eutectically bonded wafer composite.

Method for bonding wafers eutectically, and a wafer composite

A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Micromechanical component and method for producing a micromechanical component having a thin-layer cap

Measures for improving the acoustic properties of a microphone component produced in sacrificial layer technology. The micromechanical microphone structure of such a component is implemented in a layered structure, and includes at least one diaphragm, which is deflectable by sound pressure and which is implemented in a diaphragm layer, and a stationary acoustically permeable counterelement for the diaphragm which is implemented in a thick functional layer above the diaphragm layer and which is provided with through openings for introducing sound. The through openings for introducing sound are situated above the middle region of the diaphragm, while perforation openings which are largely acoustically passive are provided in the counterelement, above the edge region of the diaphragm.

Component having a micromechanical microphone structure, and method for manufacturing same

A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.

Method for attaching a first carrier device to a second carrier device and micromechanical components

A sensor element, in particular a multichannel acceleration sensor having a substrate and a seismic mass, the sensor element having a detecting element for detecting a deflection of the seismic mass relative to the substrate, and the sensor element having an excitation element for exciting a deflection of the seismic mass perpendicular to the main extension plane.

Sensor element and method for operating a sensor element

An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Method for sealing an opening

A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.

Growing community of inventors

Pfullingen, Germany

Axel Grosse