Robert Boschgmbh

Axel Franke

Johannes Classen

Daniel Christoph Meisel

Kersten Kehr

Mirko Hattass

Reinhard Neul

Torsten Ohms

Joerg Hauer

Udo-Martin Gomez

Burkhard Kuhlmann

Alexander Buhmann

Oliver Kohn

Heribert Weber

Ando Feyh

Marian Keck

Patrick Wellner

Jochen Reinmuth

Frank Fischer

Jens Frey

Tjalf Pirk

Christina Leinenbach

Po-Jui Chen

Frieder Haag

Lars Tebje

Jochen Zoellin

Fabian Henrici

Christian Rettig

Arnd Kaelberer

Heiko Stahl

Ulrich Wagner

Arnim Hoechst

Ralf Reichenbach

Dietrich Schubert

Sven Zinober

Thomas Wagner

Georg Bischopink

Achim Trautmann

Robert Sattler

Sonja Knies

Maik Wiemer

Juergen Butz

Martin Eckardt

Manuela Schmidt

Frank Freund

Hans-Joerg Faisst

Carsten Raudzis

Ralf Boessendoerfer

Kathrin Van Teeffelen

Joerg Froemel

Marco Quander

Holger Rank

Ramona Maas

Bernard Opitz

Gery O`BRIEN

Po- Jui Chen

Knut Gottfried

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Microelectromechanical sensor module and corresponding production method

A method for calibrating a selected yaw rate sensor includes: determining a scaling function between a yaw rate sensitivity and a test signal sensitivity of a yaw rate sensor selected for carrying out a test and denoted as first sampling yaw rate sensor is determined in a first method step, the scaling function being determined from a measured first sample yaw rate sensitivity and from a measured first sample test signal sensitivity of the sampling yaw rate sensor; calculating a production yaw rate sensitivity for a yaw rate sensor denoted as production yaw rate sensor from a measured production test signal sensitivity of the production yaw rate sensor and the scaling function; and subsequently calibrating the production yaw rate sensor with the aid of the production yaw rate sensitivity.

Method for calibrating yaw rate sensors

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Yaw-rate sensor

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

Hybrid integrated component

A yaw rate sensor includes a drive mass element which is situated above a surface of a substrate and is drivable to vibrate by a drive device along a first axis extending along the surface, having a detection mass element, which is deflectable under the influence of a Coriolis force along a second axis perpendicular to the surface, and having a detection device by which the deflection of the detection mass element along the second axis is detectable. Due to the arrangement of the second axis perpendicular to the surface, the yaw rate sensor may be integrated into a chip together with additional yaw rate sensors suitable for detection of rotations about axes of rotation in other directions.

Yaw rate sensor

A measuring element for recording a deflection includes a region which is situated on a semi-conductor substrate and an electrode for influencing a conductivity of the region, the electrode being mounted deflectably in relation to the region, in such a way that an overlap region is formed between the electrode and the region, the overlap region having a dimension that is variable with a deflection of the electrode. A change in the output signal of the measuring element is a function of the conductivity of the region and is controllable by a change in the dimension of the overlap region, the change in the dimension of the overlap region having a non-linear relationship with the deflection of the electrode so that a change in the output signal of the measuring element has a non-linear relationship with the deflection of the electrode.

Measuring element

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, where the movable substructures are excitable into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, where deflections of the Coriolis elements induced by a Coriolis force are detectable, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Method for constructing an electrical circuit, and electrical circuit

A sensor system having a substrate and a mass which is movably suspended relative to the substrate is described, the sensor system including detection arrangement for detecting a deflection of the seismic mass relative to the substrate along a deflection direction, the detection arrangement including a first measuring electrode affixed to the substrate and a second measuring electrode affixed to the substrate, and a first overlap, which is perpendicular to the deflection direction, between the first measuring electrode and the seismic mass along the deflection direction is greater than a second overlap, which is perpendicular to the deflection direction, between the second measuring electrode and the seismic mass.

Sensor system and method for calibrating a sensor system

A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.

Device for resonantly driving a micromechanical system

Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Hybrid intergrated component and method for the manufacture thereof

A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.

Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure

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Ditzingen, Germany

Axel Franke