Siltronic Ag

Axel Beyer

Peter Wiesner

Stefan Welsch

Carl Frintert

Patrick Berger

Matthias Guenther

Wolfgang Dietz

A method cuts slices from workpieces using a wire saw with a wire array tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. A workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while controlling a temperature of the workpiece with a cooling medium, with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in dependence on a depth of cut and in correlation with a first correction profile, and while simultaneously moving the workpiece along the workpiece axis in accordance with a specification of a second correction profile, which specifies a travel of the workpiece. The first correction profile and the second correction profile being opposed to a shape deviation.

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

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Seoul, South Korea

Axel Beyer