Cascade Microtech, Inc.

Other

Suss Microtec Test Systems Gmbh

Formfactor, Inc.

Formfactor Beaverton, Inc.

Axel Becker

Michael Teich

Stojan Kanev

Botho Hirschfeld

Ulf Hackius

Stefan Kreissig

Axel Schmidt

Joerg Kiesewetter

Dietmar Runge

Hans-Jurgen Fleischer

Steffen Schott

Enrico Herz

Wolfgang Ebert

Gunther L&ouml;hmann

J&uuml;rgen Feye-Hohmann

Benedikt Marx

Juliane Busch

Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.

Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors

Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.

Probe systems and methods that utilize a flow-regulating structure for improved collection of an optical image of a device under test

Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.

Systems and methods for handling substrates at below dew point temperatures

The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.

Modular prober and method for operating same

A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Arrangement and method for focusing a multiplane image acquisition on a prober

Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Method and apparatus for the correction of defective solder bump arrays

To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.

Probe receptacle for mounting a probe for testing semiconductor components, probe holder arm and test apparatus

An adapter for positioning of contact tips has a location surface for locating a contact tip and a base element with a base for setting the adapter on a mounting surface. A positioning element is in mechanical contact with and mobile relative to the base element. The location surface can be positioned relative to the base, in at least one positioning direction, by the positioning element which includes a gearing for converting rotary movement to translational movement in the positioning direction.

Adapter for positioning of contact tips

An electrical device such as a ballast for fluorescent lamps and including a housing, a terminal, and a catch element for connecting the terminal to the housing, the catch element including a catch leg for connecting the terminal to the catch element and for connecting the catch element to the housing. Accordingly, the electrical device is designed such that the individual terminal sites of the terminal have minimal positional tolerance so that the terminal can be wired with an automatic installation machine without the danger of misinsertions.

Growing community of inventors

Dresden, Germany

Axel Becker