Shell Case Limited

Tessera Technologies Hungary Kft.

Adeia Semiconductor Bonding Technologies Inc.

Xloom Communications, Ltd.

Tessera Technologies Ireland Limited

Avner Pierre Badehi

Sylvie Rockman

An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer.

Integrated circuit device

An electro-optic integrated circuit including an integrated circuit substrate at least one optical signal providing element and at least one discrete reflecting optical element mounted onto the integrated circuit substrate, cooperating with the at least one optical signal providing element and being operative to direct light from the at least one optical signal providing element. An electro-optic integrated circuit including an integrated circuit substrate, at least one optical signal receiving element and at least one discrete reflecting optical element mounted onto the integrated circuit substrate and cooperating with the at least one optical signal receiving element and being operative to direct light to the at least one optical signal receiving element.

Electro-optic integrated circuits and methods for the production thereof

This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.

Chip packages with covers

An integrally packaged optronic integrated circuit device () including an integrated circuit die () containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces () being transparent to radiation, and electrically insulative edge surfaces () having pads.

A packaged electro-optic integrated circuit and a multi-fiber connector including an integrated circuit substrate, at least one optical signal providing element, at least one optical signal sensor, sensing at least one optical signal from the at least one optical signal providing element and at least one discrete reflecting optical element, mounted onto the integrated circuit substrate, cooperating with the at least one optical signal providing element and being operative to direct light from the at least one optical signal providing element.

Electro-optical circuitry having integrated connector and methods for the production thereof

A method of producing a crystalline substrate based device includes forming a microstructure on a crystalline substrate. At least one packaging layer is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer.

Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced

A crystalline substrate based device includes a crystalline substrate having formed thereon a microstructure, and a transparent packaging layer which is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the packaging layer. The microstructure receives light via the transparent packaging layer.

Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby

An integrally packaged optronic integrated circuit device ( ) including an integrated circuit die ( ) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces ( ) being transparent to radiation, and electrically insulative edge surfaces ( ) having pads.

Growing community of inventors

Harei Yahuda, Israel

Avner Pierre Badehi