Amazon Technologies, Inc.

Google Inc.

Aviv Shoval

Bradley David Urban

Christopher Lorenzo Dunn

Christopher John Kraeutle

Ryan Michael Fleming

James Nelson Aldrich

Hayes Solos Raffle

Michael Arthur Simonian

Troy Hulick

Albert Lee

Sandeep Singh Waraich

Kenneth James Albanowski

Marcus-Alan Gilbert

Jacob William Beatty

Kok Yen Cheng

David Bibl

Bryan Dan Trinh

Eric Allan MacIntosh

Manuel Rosendo Arana Manzano

Adam Kenneth Cybart

Robert Olson

Eduardo Bezerra Valentin

Jeffrey Alan Matasek

Alexander Hu

Stuart Douglas

Darcy Grinolds

HongWei Zheng

David Joseph Derrick

Jeffrey Steven Salinger

Christopher Michael Buonomo

Carmela Guizar-Sanchez

Nagesh Rao Janapala

Justin Leong

Dustin Tiffany

Shaun De La Fuente

Kevin Page

Albert Chua

Lanyard

Various examples are directed to providing thermal management to a computing device. The computing device may receive temperature state data describing a temperature state of the computing device. The temperature state may comprise a first temperature value at a first location at the computing device. The computing device may also receive use state data describing a first use state of the computing device. The first use state may comprise an initial operating condition of a first component of the computing device and an initial operating condition of a second component of the computing device. The computing device may determine that at least one temperature value at the computing device is out-of-range and select a second use state for the computing device. The second use state may comprise at least one of a new operating condition for the first component or a new operating condition of the second component.

System level thermal management

Utilizing a pressure-sensitive adhesive (PSA) for assembling an electronic device can have certain benefits, such as ease of automation and instant handling or short handling time that may save time, effort, and costs during manufacturing. A liquid adhesive, on the other hand, can provide superior bond strength relative to a PSA such that a device manufactured using a liquid adhesive may perform better with respect to structural rigidity, dynamic response, impact resistance, and other reliability testing. An electronic device manufacturer can take advantage of the benefits of each type of adhesive during device assembly by incorporating both a PSA and a liquid adhesive to bond two substrates of the device, such as a cover glass or sheet and a housing structure or frame.

Hybrid bonding techniques for electronic devices

An electronic device includes an elongated tubular housing. One or more electronic components are coupled to a chassis disposed in a cavity of the tubular housing. A pair of elongated channels are positioned on opposite sides of the chassis and between the chassis and a sidewall of the tubular housing. The channels are tapered or wedge-shaped along their lengths. During assembly, one of the channels may be slid longitudinally along the other, causing the channels to expand laterally, due to their wedge shape, to secure the chassis in the tubular housing. The chassis and the pair of channels provide a thermally conductive path to dissipate heat. During use, heat generated by the electronic components is transmitted radially outward from the electronic components, through the chassis and the pair of channels, and through the tubular housing to the exterior of the portable electronic device.

Electronic device with efficient thermal dissipation

The structural rigidity of a device is improved by overmolding one or more layers of the device housing over the antenna components, improving overall wall thickness and avoiding air gaps present in conventional devices. Pull tabs are implemented for battery installation and removal using a stretch-release adhesive connected to the tabs that can hold the battery in place and, upon pulling of the pull tabs, cause the battery to be removable from the device. Camera sensors larger than the camera optics are usable in a device by utilizing only image data captured by those pixels of the sensor that correspond to the appropriate part of the camera optics. Mechanical interlocks can be used advantageously for alignment and connection strength for side soldering. Optical alignment processes are used advantageously in situations such as mounting a device camera relative to an opening of a light absorbing layer on a cover glass sheet.

Computing device components and assembly

Growing community of inventors

Palo Alto, CA, United States of America

Aviv Shoval