Kla Tencor Corporation

Kla Corporation

Kla-tencor Technologies Corporation

Aviv Balan

Yoram Uziel

Nadav Gutman

Scott Allen Young

Frank Laske

Daniel L Cavan

Ulrich Pohlmann

Vaibhaw Vishal

Luping Huang

Yale Zhang

Ariel Hildesheim

Savita Chandan

Chia-Chu Chen

Haoran Jiang

Teck Meriam

Chia-Chu Galen Chen

A first x-y translation stage, a second x-y translation stage, and a chuck are disposed in a chamber. The chuck is situated above and coupled to the second x-y translation stage, which is situated above and coupled to the first x-y translation stage. The chuck is configured to support a substrate and to be translated by the first and second x-y stages in x- and y-directions, which are substantially parallel to a surface of the chuck on which the substrate is to be mounted. A first barrier and a second barrier are also disposed in the chamber. The first barrier is coupled to the first x-y translation stage to separate a first zone of the chamber from a second zone of the chamber. The second barrier is coupled to the second x-y translation stage to separate the first zone of the chamber from a third zone of the chamber.

Multi-stage, multi-zone substrate positioning systems

A second stage is disposed on the first stage. The second stage provides six degrees of freedom. A chuck that holds a workpiece is disposed on the second stage. Actuators that enable movement in three directions are disposed on the second stage. The first stage and the second stage move independent of each other during inspection of the workpiece on the chuck.

Six degree of freedom workpiece stage

An assembly for clamping semiconductor wafers includes a plate and an electrostatic chuck mounted on the plate. A plurality of slots extends between respective portions of the electrostatic chuck to receive arms of an end-effector of a wafer-handler. The arms of the end-effector support semiconductor wafers being placed onto and removed from the electrostatic chuck.

Slotted electrostatic chuck

Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.

Methods and systems for chucking a warped wafer

Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.

Floating wafer chuck

A semiconductor sample is received on a chuck of a stage that is movable with respect to a stage frame. The stage, chuck, and sample are moved under an inspection or exposure head for inspecting or exposing the sample, and multiple 2D encoder heads are coupled with the chuck. Multiple 2D encoder scales are coupled with a base through which the head is inserted, and a stage encoder is positioned on the stage frame. Movement of the stage, chuck, and sample is controlled based on a position detected by at least one of the 2D encoder heads until a predefined position that is within a gap that is not covered by the 2D encoder scales is reached. Movement control of the stage, chuck, and sample is switched to being based on a position detected by the stage encoder when such predefined position that is within the gap is reached.

Stage apparatus for semiconductor inspection and lithography systems

A system having a beam for providing movement of a first stage and a second stage in a Y axis. The first stage receives a first substrate. A first motor provides movement for the first stage in an X axis. The second stage receives a second substrate. A second motor provides movement for the second stage in the X axis. The first stage and the second stage move together in the Y axis and independently in the X axis. A robot loads substrates onto the first stage and the second stage. A controller directs the robot to load a second substrate onto the second stage while simultaneously directing the first stage and the guide beam to scan a first substrate.

Dual scanning stage

A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.

Active planar autofocus

A profilometer having a guide beam for providing translational movement of substrates in a Y axis relative to a stylus. A first stage receives a first substrate, where the first stage is slidably mounted to the guide beam. The first stage is associated with a first motor for providing independent translational movement for the first stage in an X axis relative to the stylus. A second stage receives a second substrate, where the second stage is slidably mounted to the guide beam. The second stage is associated with a second motor for providing independent translational movement for the second stage in the X axis relative to the stylus, where the first stage and the second stage move together in the Y axis as the guide beam moves in the Y axis, and move independently of one another in the X axis. A robot loads the substrates onto and unloads the substrates off of the first stage and the second stage. A controller directs the robot to load the second substrate onto the second stage, while simultaneously directing the first stage and the guide beam to scan the first substrate on the first stage in the X and Y axes under the stylus, thereby generating profile readings of the first substrate on the first stage.

A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate while the substrate is retained by the chuck, and thereby keeping the substrate from contacting the substrate receiving surface. The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate while the substrate is retained by the chuck, and thereby retaining the substrate proximate the substrate receiving surface. Retaining means retain the substrate in X-Y directions from sliding off of the substrate receiving surface.

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Mountain View, CA, United States of America

Aviv Balan