Teledyne Scientific and Imaging, LLC

Rockwell Automation Technologies Incorporated

Avijit Bhunia

Steve Qingjun Cai

Tadej Semenic

Olivier H Sudre

Kyle D Gould

Chung-Lung Chen

Qingjun Cai

Keisuke Shinohara

Paul Jerome Grosskreuz

Miguel Urteaga

Casey King

Jeffrey William Dujmovic

Ya-Chi Chen

Alex P Moffatt

Seongchul Jun

Mark R Gardner

Steve Cai

Cookware and a method of manufacture thereof are provided. The method comprises forming a fluid conduit defining a volume in a base of the cookware, the base comprising a heating zone configured for thermal communication with the fluid conduit. A working fluid is introduced to the fluid conduit via an open end of the fluid conduit. A liquid phase of the working fluid occupies less than the volume of the fluid conduit. The fluid conduit is Sized and configured to form vapor segments and liquid segments interspersed throughout the fluid conduit from the working fluid. The open end of the fluid conduit is sealed to define a closed fluid system.

Cookware and a method of manufacture thereof

A system for thermal management and structural containment includes an enclosure, a heat source disposed within the enclosure; and a wick encompassing at least a portion of an outer surface of the heat source.

Multi-functional high temperature structure for thermal management and prevention of explosion propagation

A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix disposed about an outer casing of the first battery cell.

Multi-functional structure for thermal management and prevention of failure propagation

A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix formed in an outer casing of the first battery cell.

A heat sink for use with a heat generating component such as an electronic power module comprises a first substrate having a serpentine slot, a second substrate secured to a first side of the first substrate to form a combined substrate, surfaces of the first and second substrates at least partially forming a serpentine passageway within the combined substrate for containing a fluid. The serpentine passageway has a non-circular cross-sectional shape.

Power module heat sink with high conductivity heat spreader

A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.

Thermal interface material system

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

Interface-free thermal management system for high power devices co-fabricated with electronic circuit

An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.

Osmotic transport system for evaporative cooling

A FET employing a micro-scale device array structure comprises a substrate on which an epitaxial active channel area has been grown, with a plurality of micro-cells uniformly distributed over the active channel area. Each micro-cell comprises a source electrode, a drain electrode, and at least one gate electrode, with a first metal layer interconnecting either the drain or the source electrodes, a second metal layer interconnecting the gate electrodes, and a third metal layer interconnecting the other of the drain or source electrodes. Each micro-cell preferably comprises a source or drain electrode at the center of the micro-cell, with the corresponding drain or source electrode surrounding the center electrode. The number and width of the gate electrodes in each micro-cell may be selected to achieve a desired power density and/or heat distribution, and/or to minimize the FET's junction temperature. The FET structure may be used to form, for example, HEMTs or MESFETs.

FET with micro-scale device array

A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.

System for using active and passive cooling for high power thermal management

A cooling apparatus includes a direct-bonded copper ('DBC') substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.

Growing community of inventors

Newbury Park, CA, United States of America

Avijit Bhunia