Intel Corporation

Aviad Cohen

Lev Finkelstein

Ronny Ronen

Efraim Rotem

Dmitry Rudoy

Doron Rajwan

Avi Mendelson

Oren Lamdan

Yossi Abulafia

Adam De La Zerda

Methods and apparatus relating to power management for multiple processor cores are described. In one embodiment, one or more techniques may be utilized locally (e.g., on a per core basis) to manage power consumption in a processor. In another embodiment, power may be distributed among different power planes of a processor based on energy-based considerations. Other embodiments are also disclosed and claimed.

Power management for multiple processor cores

A method for dynamically operating a multi-core processor system is provided. The method involves ascertaining currently active processor cores, identifying a currently active processor core having a lowest operating frequency, and adjusting at least one operational parameter according to voltage-frequency characteristics corresponding to the identified processor core to fulfill a predefined functional mode, e.g. power optimization mode, performance optimization mode and mixed mode.

Method for optimizing voltage-frequency setup in multi-core processor systems

A technique to dynamically maintain the thermal levels of a plurality of cores of a processing system by interleave core hopping with throttling techniques. The interleaving logic may transfer execution of threads from a hot core to a cold if core hopping is applicable. Core hopping may be applicable if there exist a cold core to which the execution of threads can be assigned to from a hot core and if the rate of occurrence of core hopping is within an allowable rate value. The interleaving logic may apply throttling techniques if core hopping is not applicable. The throttling techniques may throttle the throttling parameters, which may comprise voltage, frequency, and micro-architecture throttling parameters provided to the hot core if the core hopping is not applicable.

Dynamically managing thermal levels in a processing system

Methods, apparatus, and articles of manufacture control a device or system that has an operational limit related to the rate or frequency of operation. The frequency of operation is controlled at a variable rate calculated to maximize the system or apparatus performance over a calculated period of time short enough that a controlling factor, such as power consumption, does not vary significantly during the period. Known system parameters, such as thermal resistance and capacitance of an integrated circuit (IC) and its package, and measured values, such as current junction temperature in an IC, are used to calculate a time-dependent frequency of operation for the upcoming time period that results in the best overall performance without exceeding the operational limit, such as the junction temperature.

Methods and apparatus for optimal voltage and frequency control of thermally limited systems

Systems and methods of thermal management provide for dynamically the upper and lower operating points of a throttled device such as a processor. In one embodiment, it is determined that the temperature of the processor is below a threshold and moving the upper operating point and the lower operating point toward one another.

Adaptive thermal-based frequency-bounds control

The operating rate of an electronic system is maximized without exceeding a thermal constraint, such as a maximum junction temperature of an integrated circuit (IC) or other portion of the electronic system. An operating parameter of the system that controls the thermal output of the system is calculated for an upcoming time period based upon the previously measured thermal performance relationship to the operating parameter level. If the predicted thermal performance will exceed a maximum allowable level of the thermal constraint, then the operating parameter is reduced by an amount calculated to keep the thermal constraint at a level just below the maximum allowable level, thus resulting in an optimal control approach to maximizing the system performance while not exceeding the thermal constraint.

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Bat-Chen, Israel

Aviad Cohen