Microsoft Technology Licensing, LLC

Apple Inc.

Google Inc.

Avi Hecht

Robyn Rebecca Reed McLaughlin

Andrew William Hill

James Michael Bonicatto

Jeffrey Taylor Stellman

Kenneth Charles Boman

Bruce M Schena

Colin M Ely

Lawrence K Lam

William Riis Hamburgen

Jeffrey Y Hayashida

Andreas Georg Nowatzyk

Errol Mark Tazbaz

John Stuart Fitch

James Alec Ishihara

Kelvin Kwong

Yi Tao

James Cooper

Kiarash Vakhshouri

Jonathan Nivet

A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Bend limit film

A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.

Apparatuses, systems, and methods for improved heat dissipation

Enclosure thermal short

The description relates to devices, such as computing devices that have hinged portions. One example can include a first portion and a second portion. This example can also include a flexible multi-pivot hinge cover assembly rotatably securing the first and second portions.

Multi-pivot hinge cover

Systems and methods involving reconfigurable rotating masses are disclosed. One embodiment may take the form of a system having a motor and coupled weights attached to the motor. Operation of the motor rotates the coupled weights and the weights are dynamically reconfigurable to change the location of the center of mass relative to an axis of rotation.

Dynamic mass reconfiguration

Growing community of inventors

Mountain View, CA, United States of America

Avi Hecht