Pacesetter, Inc.

Avi Bilu

Ofer Rosenzweig

Asghar Dadashian

Armando M Cappa

Kavous Sahabi

Christopher R Jenney

Arees Garabed

Xiangqun Chen

Evan Sheldon

Dino Bortolin

Alexander Robertson

Daniel Choi

Sean Portune

A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end. The first end includes a first recess that opens axially and receives therein a portion of the first electrically conductive segment.

Connector for use in injection molded header of implantable pulse generator

Disclosed herein is an implantable electronic device for use with implantable medical leads. The implantable medical leads are retained within the implantable electronic device with coated setscrews and, in particular, setscrews having a vapor-deposited coating, such as parylene. The coated setscrews have improved thread locking capabilities that resist unscrewing once tightened and, as a result, improve retention of implantable leads within the implantable electronic device.

Implantable electronic device employing coated lead retaining setscrews

The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metallic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.

Implantable medical devices including a laser etched surface in bonded areas

Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.

Implantable electronic device employing fused thermoplastic-conductor subassembly and method of manufacturing the subassembly and the device

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Pasadena, CA, United States of America

Avi Bilu