Dell Products Inc.

Austin Michael Shelnutt

Travis Christian North

Edmond Ira Bailey

Christopher Michael Helberg

James Don Curlee

Richard Steven Mills

John R Stuewe

John Trevor Morrison

Mark Andrew Schwager

Chris M Helberg

Steven Embleton

Joseph Michael Sekel

Andrew Thomas Sultenfuss

Paul W Vancil

Chin-An Huang

Deeder M Aurongzeb

Jimmy Doyle Pike

Shawn Paul Hoss

Tyler B Duncan

Haesung Kwon

David Michael Meyers

Christian Markus Petersen

Shane Kavanagh

Kevin Warren Mundt

Ty R Schmitt

Nan Wang

Eric Michael Tunks

Mark Mcgrath Bailey

Ben John Sy

Robert Boyd Curtis

Thomas Alexander Shows

Joseph Andrew Vivio

Philip Joseph Grossmann

Walter R Carver

Joohyun Woo

Daniel Alvarado

Edward Douglas Knapton

Kevin Brian Locke

Rene Jason Salas

Duen Hsing Hsieh

German Florez-Larrahondo

Julian Yu-Hao Chen

Walt R Carver

Stephen P Rousset

Shun-cheng Hsu

Shih-Tien Cheng

Charles Edward Smith

Chia-Chuan Yu

Sharadha Parthasarathy

Methods, systems, and devices for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer-implemented services. To provide the computer-implemented services, hardware components of the data processing system may need to operate within certain thermal dissipation requirements. To regulate the temperature of the hardware components, a fan may circulate air through the data processing system when the temperatures fall outside the thermal dissipation requirements. To regulate the temperature of the hardware components more efficiently, higher air flow rates may be desired. To increase air flow rates, a three-dimensional ventilation port may be implemented to de-constrict air flow when air enters or exits the data processing system.

System and method for improving rate of air flow through data processing systems

An information handling system may include a main chassis and a motherboard-less expansion chassis. The main chassis may include a host system motherboard and a first host interconnect card. The motherboard-less expansion chassis may include a second host interconnect card communicatively coupled to the first interconnect card via an external cable having one or more in-band signal channels and one or more sideband signal channels, a first information handling resource configured to communicate data with the host system motherboard via the one or more in-band signal channels, and a second information handling resource configured to communicate control signals with the host system motherboard via the one or more sideband signal channels.

Systems and methods for power and cooling control of expansion chassis using host interface card sideband signals

Performance of a system may be boosted with a boost dock that seals fan interfaces to improve airflow through an information handling system. An apparatus may include a first port configured to seal a first interface between the apparatus and an information handling system. The apparatus may also include a first blower configured to receive ambient air as cool intake air and to blow the cool intake air into the information handling system through the first interface sealed by the first port. The apparatus may further include a second blower configured to receive warm exhaust air from the information handling system through the first interface sealed by the first port and to blow the warm exhaust air out of the apparatus. A method may include steps of sealing a first interface, receiving ambient air, blowing cool intake air, receiving warm exhaust air, and blowing warm exhaust air.

Multi-fan sealed boost dock

A method for cooling IT equipment of a velocity cooled (VC) mobile data center (MDC) includes: determining if a velocity of the VC MDC is above a minimum threshold velocity that enables ram air cooling of IT equipment within the VC MDC; and in response to the velocity not being above the minimum threshold velocity, activating a secondary cooling source to provide a flow of cooling air across the IT equipment within the VC MDC, the flow of cooling air supplementing the ram air cooling.

Modulating AHU vs RAM air cooling, based on vehicular velocity

A method for implementing power capping in a velocity cooled (VC) mobile data center (MDC). A management information handling system (IHS) applies a power cap for all power consuming components of the VC MDC based, in part, on the detected velocity of the VC MDC. The detected velocity is compared to an outside air cooling threshold velocity. In response to the detected velocity being below the outside air cooling threshold velocity, a first power cap is selected, based on the detected velocity being below the outside air cooling threshold velocity. In response to the detected velocity being at or above the outside air cooling threshold velocity, a second, higher, power cap is selected, based in part on the detected velocity being at or above the outside air cooling threshold velocity. Power capping is implemented to conserve available onboard power for IT equipment processing, based on availability of ram air cooling.

Velocity-based power capping for a server cooled by air flow induced from a moving vehicle

A system may include a tank configured to hold a dielectric liquid, a rack located within the tank and having a plurality of bays, each bay configured to receive a corresponding device, an air pump configured to drive an air flow, at least one variable-buoyancy chamber mechanically coupled to at least one of the tank and the rack, each of the at least one variable-buoyancy chamber comprising a fluidically-sealed plenum and wherein the at least one variable-buoyancy chamber is configured to mechanically couple to a device-in-service, and a control subsystem configured to control a buoyancy of the at least one variable-buoyancy chamber in order to cause movement of the device-in-service relative to the rack.

Systems and methods for buoyancy-assisted immersion server maintenance

A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion to a vapor chamber integrated in a lid housing portion that distributes the thermal energy across the lid housing portion. A hinge protrusion formed in the lid housing portion defines a cylindrical opening that accepts a hinge pin to rotationally couple the housing portions to each other. The cylindrical wall defines a barrier with the vapor chamber so that a thermal conduit passing from the main housing portion to the hinge pin transfers thermal energy from the hinge pin through the cylindrical wall to the vapor chamber.

Information handling system housing integrated vapor chamber

A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.

Information handling system dynamic thermal transfer control

A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.

System and method for injecting cooling air into servers in a server rack

A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Rack information handling system having modular liquid distribution (MLD) conduits

In accordance with embodiments of the present disclosure, a controller may include one or more environmental sensor inputs configured to receive data from one or more environmental sensors integral to an information handling system and a microcontroller unit communicatively coupled to the one or more environmental sensor inputs. The microcontroller unit may be configured to monitor the one or more environmental sensor inputs for one or more reliability-impacting events affecting or likely to affect operability of the information handling system and in response to an occurrence of a reliability-impacting event, apply an event-based policy affecting operation of one or more components of the information handling system.

Systems and methods for reliability control of information handling system

A portable information handling system transfers thermal energy associated with operation of processing components in a first housing portion to a thermal exchanger in a second housing portion through a hinge that rotationally couples the first and second housing portions. The hinge has first and second axles that each define a channel. Fluid heated at the first housing portion passes through the channel to the thermal exchanger where thermal energy is rejected from the system. In one embodiment, a second hinge having first and second axles that each define a channel provides a return path for the fluid from the second housing portion to the first housing portion.

Information handling system thermal fluid hinge

A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.

Information handling system thermally conductive hinge

A mobile data storage system includes a volumetric container of a mobile data center having IT equipment operating therein and an on-board high capacity storage (HCS). A storage compartment is configured within the container and is accessible from an exterior of the container. The storage compartment includes a plurality of individual storage slots each providing a docking port for connecting a removable data storage device (RDSD). At least one RDSD is inserted into a first storage slot of the plurality of storage slots. The RDSD facilitates rapid transfer of data to the MDC from edge data acquisition systems and to a data center facility. A management information handling system (IHS) is communicatively coupled to the HCS and to each docking port. The management IHS is configured to detect insertion of an RDSD into a docking port and coordinate a transfer of data from the RDSD to the HCS.

High capacity, secure access, mobile storage exchange system

A method of manufacturing a chassis that cools thermal energy generating components of an information handling system (IHS) includes: forming an enclosure with a chassis that has a base wall for provisioning a thermal energy generating component; forming one or more stiffeners each having one or more air channels formed transversely through for directing air proximate to the base wall; attaching the one or more stiffeners laterally across the base wall; and attaching a planar member that is horizontally on top of the one or more stiffeners for engaging one or more forward compute components on top of the planar member that substantially block air flow above the planar member to the thermal energy generating component. The one or more air channels eliminate thermal shadowing caused by thermal energy generating components provisioned in a rear area of the chassis.

Airflow channeling structure for densely packed storage enclosures

Growing community of inventors

Leander, TX, United States of America

Austin Michael Shelnutt