Xilinx, Inc.

Candela Electronics, Inc.

Vista Labs, Inc.

Francis, Robert J.

Austin H Lesea

Stephen M Trimberger

Robert O Conn

Steven P Young

Michael J Hart

Peter H Alfke

Joseph J Fabula

Martin L Voogel

Kun-Yung Chang

Paul R Schumacher

Sundararajarao Mohan

Jan Lodewijk De Jong

Atul V Ghia

Patrick J Crotty

Christopher H Kingsley

Shahin Toutounchi

Kevin T Look

John D Logue

Carl H Carmichael

Pierre Maillard

Saar Drimer

Sen Lin

Jameel Hussein

Raymond J Matteis

Tan Canh Hoang

Bernard J New

Philip Bryn James-Roxby

Jennifer Wong

Tim Tuan

Alireza S Kaviani

Patrick Lysaght

Wei Guang Lu

Jun Liu

Graham F Schelle

Derek R Curd

Jason J Moore

Gary R Lawman

Praful Jain

Mark A Alexander

Yi-Hua Edward Yang

Michael D Nelson

Sundeep Ram Gopal Agarwal

Satyaki Das

Khaldoon S Abugharbieh

Yiding Wu

Nicholas Joseph Possley

Kenneth D Chapman

Ching Yee Hu

Daniel J Ferris, Iii

Michael A Margolese

John S Elward

Nathan Bialke

Robert E Eccles

Loren Jones

Kevin Boshears

Jeffrey Barton

Antolin S Agatep

Robert J Francis

Andrew R Percey

Alfred L Rodriguez

Anti-spoofing of a deep learning neural network may include receiving, by an artificial neural network implemented in hardware, an image and multi-dimensional spatial frequency data for the image. The artificial neural network is trained using training images and multi-dimensional spatial frequency data for the training images. Using the artificial neural network, a classification for an object in an image is determined based on the image and the multi-dimensional spatial frequency data for the image.

Anti-spoofing of neural networks

An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.

Integration of a programmable device and a processing system in an integrated circuit package

Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes multiple lasers that input an electronic signal. Each laser encodes and outputs a respective optical data signal based on the electronic signal. Each laser has a different configuration of one or more first optical parameters. A first selection circuit selects the respective optical data signal from one of the lasers. Multiple optical components configure second optical parameters of an input optical data signal. A second selection circuit inputs the selected optical data signal from the first selection circuit and provides the selected optical data signal to one of the optical components. A third selection circuit selects the optical data signal output from the one optical component.

Optical communication circuits

Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes a package substrate and f first interposer mounted on the package substrate. The apparatus also includes a logic circuit and an optical interface circuit connected to the logic circuit via the first interposer. One of the optical interface circuit or the logic circuit is mounted on the first interposer. The optical interface circuit includes a driver circuit configured to receive electronic data signals from the logic circuit. The optical interface circuit also includes an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.

An integrated circuit is provided for obtaining interrupt performance metrics. The integrated circuit includes a microprocessor executing an interrupt service routing monitoring framework that includes an interrupt handler and an application programming interface. The interrupt handler executes in response to a trigger condition and obtains timing data that includes at least one sample of a value of a timing logic according to a sampling schedule. The API exposes interrupt configuration functionality for registering the interrupt handler with a supervisory program and for configuring the interrupt handler to obtain the timing data.

Active interrupt handler performance monitoring in microprocessors

A method and apparatus are provided that includes an electronic device, a chip package and a method for cooling a chip package in an electronic device. In one example, the chip package includes an interposer or package substrate having a first IC die and a second IC die mounted thereon. The second IC die has a maximum safe operating temperature that is greater than a maximum safe operating temperature of the first IC die. An indicia is disposed on the chip package. The indicia designates an installation orientation of the interposer or package substrate which positions the first IC die upstream of the second IC die relative to a direction of cooling fluid flow.

Lateral cooling for multi-chip packages

Systems and methods therefor relating generally to electro-absorption modulation are disclosed. In a system thereof, a waveguide is for propagating an optical signal. A segmented electro-absorption modulator ('SEAM') includes: a segmented anode having at least two anode segments spaced apart from one another alongside a first side of the waveguide; and a segmented cathode having at least two cathode segments spaced apart from one another alongside a second side of the waveguide corresponding to the at least two anode segments.

Segmented electro-absorption modulation

Embodiments herein describe techniques for testing or aligning optical components in a photonic chip using a grating coupler. In one embodiment, the photonic chip may include an edge coupler and a grating coupler for optically coupling the photonic chip to external fiber optic cables. The edge coupler may be disposed on a side or edge of the photonic chip while the grating coupler is located on a top or side of the photonic chip. During fabrication, the edge coupler may be inaccessible. Instead of using the edge coupler to test the photonic chip, a testing apparatus can use the grating coupler along with a splitter to transfer optical test signals between an optical component in the photonic chip (e.g., a modulator or detector) and a test probe optically coupled to the grating coupler.

Architecture for silicon photonics enabling wafer probe and test

In an adaptation module relating generally to adaptive optical channel compensation, an analysis module is coupled to receive a first data signal and a second data signal and coupled to provide first information and second information. A comparison module is coupled to compare the first information and the second information to provide third information. An adjustment module is coupled to receive the third information to provide fourth information to compensate for distortion in the second data signal with reference to the first data signal. The second data signal is associated with a conversion of the first data signal to an optical signal for communication via an optical channel.

Adaptive optical channel compensation

A circuit for routing data between die of an integrated circuit is described. The circuit comprises differential transmitter and receiver pairs of different integrated circuit die that are coupled together by differential transmission lines. A separate differential transmitter associated with the first die of the integrated circuit and a separate differential receiver associated with the second die of the integrated circuit are configured to transmit data day way of the differential transmission lines associated with the differential transmitter and receiver pairs.

Circuit for and method of routing data between die of an integrated circuit

Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations an optical communication device includes an optical data port configured to support an optical fiber in a fixed position. The optical communication device may further include a plurality of optical communication circuits, each oriented to communicate optical signals at a respective position of a cross section of the optical fiber connected to the optical data port and a control circuit, responsive to optical signals communicated on the optical fiber connected to the optical data port and configured to determine ones of the plurality of optical communication circuits that are misaligned with the optical fiber and disable the determined ones of the plurality of optical communication circuits.

A system includes an integrated circuit (IC) chip with connections to plurality of external pins. An integrated voltage regulator circuit is configured to provide an internal supply voltage to the IC chip. Isolation circuitry is configured to inhibit tampering of the internal supply voltage through the external pins. An analog to digital converter (ADC) circuit is configured to monitor parameters of the internal supply voltage. Security circuitry is configured to detect, using the monitored parameters, indications of tampering and to generate an error signal in response to detecting an indication of tampering.

Secure voltage regulator

Systems, and related methods, relating generally to electro-absorption modulation are described. In a system therefor, there is a waveguide. A photodetector is configured with respect to the waveguide for detecting luminous intensity of an optical signal. An electro-absorption modulator is configured with respect to the waveguide for electro-absorption modulation of the optical signal. An integrated heating element is located alongside and spaced apart from both the photodetector and the electro-absorption modulator. the integrated heating element is configured for controllably heating the photodetector and the electro-absorption modulator.

Electro-absorption modulation with an integrated photodetector

A method of enabling a communication channel between a first communication circuit and a second communication circuit is described. The method comprises establishing a communication link according to a communication protocol between the first communication circuit and the second communication circuit, wherein the communication protocol enables the transmission of data between the first communication circuit and the second communication circuit at a standardized data rate; determining a standardized data rate for which the communication link between the first communication circuit and the second communication circuit fails to meet a predetermined quality threshold; and establishing a communication link according to the communication protocol at a non-standardized data rate below the determined standardized data rate.

Method of and circuit for enabling a communication channel

Growing community of inventors

Los Gatos, CA, United States of America

Austin H Lesea