3M Innovative Properties Company

Audrey S Forticaux

Jeremy M Higgins

Wayne Scott Mahoney

John Charles Clark

Eric G Larson

Wendy L Thompson

Timothy D Fletcher

Scott B Charles

Jay R Lomeda

Brett A Beiermann

Kyle R Schwartz

Duane Douglas Fansler

Jimmie Rae Baran, Jr

Clinton P Waller, Jr

Satinder K Nayar

Bharat R Acharya

Derek J Dehn

Carla S Thomas

Brandon Alan Bartling

Qin Lin

Ying Lin

Joshua M Fishman

Caitlin E Meree

Jimmie R Baran

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Polymer matrix composites comprising thermally conductive particles and methods of making the same

Reaction mixtures, foams prepared from the reaction mixtures, articles containing the foams, and methods of making the foams are provided. The polymeric material in the foam is formed from a polymerizable composition that includes a di(meth)acrylate oligomer and a monomer having a single ethylenically unsaturated group. The foams are highly filled (e.g., at least 60 volume percent of the foam is the filler) and can be thermally conductive. Although the foams contain a large amount of filler, the foams can be compressed at least 40 volume percent with an applied pressure of 50 pounds per square inch (345 kiloPascals).

Foams and methods of making

Growing community of inventors

Minneapolis, MN, United States of America

Audrey S Forticaux