Nec Corporation

Atushi Kobayashi

Masashi Ohi

Takashi Fukaumi

Hiromichi Taniguchi

Toshihiko Nishiyama

Shinji Takeoka

Yoshihiko Saiki

Kimihisa Yamamoto

Tomitaro Hara

Tomohide Date

Kazuaki Fukushima

Eishun Tuchida

A fabrication method of a solid electrolytic capacitor is provided, which decreases the necessary repetition number of adhesion steps of an oxidizing agent and a monomer of a conducting polymer to a dielectric of the capacitor while keeping the coverage ratio at a satisfactorily high level. A capacitor body with an oxide layer is first immersed into an oxidizer solution at a room temperature under an atmospheric pressure. The oxidizer solution has a viscosity ranging from 100 to 500 cp at room temperature under the atmospheric pressure. Then, the oxidizer solution adhered to the oxide layer is dried to remove a solvent of the adhered solution and to leave the oxidizing agent on the oxide layer. The oxidizing agent left on the oxide layer is in solid phase at room temperature under the atmospheric pressure. The capacitor body with the oxide layer is immersed into a monomer of a conducting polymer. The monomer of the conducting polymer adhered to the oxide layer is polymerized by the oxidizer left on the oxide layer, thereby forming a layer of the conducting polymer on the oxide layer. These steps are repeated until a desired thickness of the polymer layer is accomplished.

Fabrication method of solid electrolytic capacitor

An oxidant solution for synthesizing a heat-resistant electroconductive polymer, composed of a solution of a non-protonic organic solvent and an oxidant of the organic compound iron salt expressed by the following formula:

Oxzidant solution for synthesizing heat-resistant electroconductive

A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.

Method of forming chip-formed solid electrolytic capacitor without an

Chip-formed solid electrolytic capacitor without an anode lead

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Tokyo, Japan

Atushi Kobayashi