Sarnoff Corporation

Other

E.i. Dupont De Nemours and Company

Fry's Metals, Inc.

Thomson Licensing

Thomson Licensing S.a.

Sharp Corporation

David Sarnoff Research Center, Inc.

Lamina Ceramics, Inc.

Sharp K.k.

Powerzyme, Inc.

Attiganal Narayanaswamy Sreeram

Leszek Hozer

Ashok Narayan Prabhu

Michael James Liberatore

Ellen Schwartz Tormey

Kalipada Palit

Gerard R Minogue

Bawa Singh

William J Borland

Barry Jay Thaler

Dennis Lee Matthies

Brian Lewis

George H Riddle

Daniel Irwin Amey, Jr

David Ross McGregor

John P Laughlin

Karl Hartmann Dietz

Sounak Banerji

Ashok Naryan Prabhu

Anthony E Ingham

Les Hozer

David V Kyaw

George Herbert Needham Riddle

John Charles Connolly

Robert L Quinn

Ramon Ubaldo Martinelli

Roger Casanova Alig

Aly Eid Fathy

Rajan Kumar

Mark Stuart Hammond

Zhonghui Hugh Fan

Ponnuswamy Palanisamy

Joo-Dong Yu

Yun-Hwi Park

Sung-Dae Park

Je-Do Mun

In-Tae Kim

Chetna Bindra

Gerard Minogue

The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.

Power core devices and methods of making thereof

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

Thermal interface material and solder preforms

The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.

Power core devices

A color cathode-ray tube (CRT) having an evacuated envelope with an electron gun therein for generating at least one electron beam is provided. The envelope further includes a faceplate panel having a luminescent screen with phosphor elements on an interior surface thereof. A focus mask, having a plurality of spaced-apart first conductive strands, is located adjacent to an effective picture area of the screen. The spacing between the first conductive strands defines a plurality of apertures substantially parallel to the phosphor elements on the screen. Each of the first conductive strands has a substantially continuous insulating material layer formed on a screen facing side thereof. A plurality of second conductive wires are oriented substantially perpendicular to the plurality of first conductive strands and are bonded thereto by the insulating material layer. The insulating material layer comprises a low porosity lead-zinc-borosilicate glass.

Methods to improve insulator performance for cathode-ray tube (CRT) applications

A color cathode-ray tube (CRT) having an evacuated envelope with an electron gun therein for generating at least one electron beam is provided. The envelope further includes a faceplate panel having a luminescent screen with phosphor elements on an interior surface thereof. A focus mask, having a plurality of spaced-apart first conductive strands, is located adjacent to an effective picture area of the screen. The spacing between the first conductive strands defines a plurality of apertures substantially parallel to the phosphor elements on the screen. Each of the first conductive strands has a substantially continuous insulating material layer formed on a screen facing side thereof. A plurality of second conductive wires are oriented substantially perpendicular to the plurality of first conductive lines and are bonded thereto by the insulating material layer. The insulating material layer comprises a low porosity lead-zinc-borosilicate glass.

Cathode-ray tube having a focus mask with improved insulator performance

An electron gun as for a cathode ray tube includes a plurality of electrodes biased at different potentials to electrostatically shape and focus the one or more electron beams produced thereby. A dynamic focus grid is driven by a substantial ac voltage signal at the horizontal line rate, which signal is undesirably coupled through parasitic capacitance to an intermediate grid located between the dynamic focus grid and the gun anode. A resistive biasing network includes a high value resistance to divide the anode potential to develop bias potential for the intermediate grid and a capacitance to ac couple the intermediate grid to ground potential. The resistance is formed in a single layer ceramic circuit and the capacitance is formed on the single layer ceramic circuit or on the tube neck. The ceramic circuit may be located in the tube neck on or with the electron gun.

Electron gun with resistor and capacitor

A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

Thermal interface material and heat sink configuration

Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

Materials to fabricate a high resolution plasma display back panel

Provided is a fuel cell comprising a first compartment, a second compartment and a barrier separating the first and second compartments, wherein the barrier comprises a proton transporting moiety.

Enzymatic fuel cell

Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology

A plasma display device of the type having a composite back plate including a metal substrate and a ceramic barrier rib structure, is formed using a green ceramic tape which is a combination of two glasses, a primary glass which flows back during firing and a secondary glass that has a relatively high thermal coefficient of expansion. These glasses are combined in proportion to match the thermal coefficient of expansion of the metal substrate. Channels are formed on the inner surface of the back panel by laminating a green ceramic tape to the metal substrate and then soaking the laminated tape in a solvent before embossing the green tape to form the ribs. This soaking step enhances the flow of the green ceramic tape during the embossing process. The ceramic components of the green tape are formulated with a particle size 15 &mgr;m or more to enhance particle flow when the green tape is embossed. Electrodes are printed onto one or more of the green ceramic tape layers, by screen printing using a metal emulsion screen, prior to embossing such that the electrode layer covers all or substantially all of the green tape layer and the electrodes are separated by the embossing process. Alternatively, the electrodes are printed onto one or more of the green ceramic tape layers using a conductive ink which may be applied using an ink-jet printing technique. In another alternative, the electrodes are formed from sheets of conductive material and applied to the back panel either before or after the panel is embossed.

Method for making an embossed plasma display back panel

An integrated double sided metal supported display device has a green tape stack on both sides of the metal support. The green tape stacks incorporate circuitry and conductor filled vias to access the circuitry electrically on each green tape layer. The metal support has a plurality of openings to access both of the green tape stacks. These openings are made by forming the openings in the metal support, filling them with a dielectric that has a thermal coefficient of expansion close to that of the metal support, forming an opening in the dielectric and filling the opening with a conductive ink.

Method for fabricating double sided ceramic circuit boards using a titanium support substrate

High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.

High dielectric constant embedded capacitors

A plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. Conductive electrodes are on the surface of or imbedded in the dielectric layer of the back panel. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. Barrier ribs are formed on the back panel by embossing the green tape before cofiring the bonded assembly. The green tape is embossed using pulsed pressure and an embossing tool that is formed by assembling embossing members and spacing members in compression. The embossing tool further includes elastic spacers mounted outside of the embossing tool and in a position such that the elastic spacers are held in compression during the embossing operation to aid in releasing the embossed green tape from the embossing tool after the embossing operation.

Back panel for a plasma display device

Growing community of inventors

Princeton, NJ, United States of America

Attiganal Narayanaswamy Sreeram