Tdk Corporation

Atsushi Yoshino

Shuichi Takizawa

Hironori Sato

Hideki Kachi

Hiromu Harada

Yuki Okino

Disclosed herein is an electronic circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Electronic circuit module

Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Electric circuit module and manufacturing method thereof

A circuit modulecomprises: a wiring structure; at least one electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which at least one electronic componentis embedded; and a metal layerprovided on the upper surface of the insulating resin layer. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layeris expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layeris expressed as R2. At least one R1 satisfies the condition: R1&#x3e;R2.

Circuit module

A circuit modulecomprises: a wiring structure; at least one electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which at least one electronic componentis embedded; and a metal layerprovided on the upper surface of the insulating resin layer. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layeris expressed as RThe surface roughness of the portion Sother than the portion directly above all the electronic components on the upper surface of the insulating resin layeris expressed as RAt least one Rsatisfies the condition: R&#x3e;R

A circuit modulecomprises: a wiring structure; at least one electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which at least one electronic componentis embedded; and a metal layerprovided on the upper surface of the insulating resin layer. The surface roughness of the portion Sdirectly above each electronic component on the upper surface of the insulating resin layeris expressed as R. The surface roughness of the portion Sother than the portion directly above all the electronic components on the upper surface of the insulating resin layeris expressed as R. At least one Rsatisfies the condition: R&#x3e;R

A circuit modulecomprises: a wiring structure; an electronic componentarranged on the upper surface of the wiring structure; an insulating resin layerwhich is provided on the upper surface of the wiring structureand in which the electronic componentis embedded; and a metal layerprovided on a side surface Sof the insulating resin layerand a side surface Sof the wiring structure. The surface roughness of the side surface Sof the insulating resin layeris expressed as R. The surface roughness of the side surface Sof the wiring structureis expressed as R. Rand Rdiffer from each other.

Growing community of inventors

Tokyo, Japan

Atsushi Yoshino