Sony Corporation

Sony Semiconductor Solutions Corporation

Atsushi Yoshida

Yuuji Kishigami

Hidetsugu Otani

To reduce deformation of an imaging device and to prevent a reduction in image quality. The imaging device includes an imaging element, a substrate, and a connection portion. The substrate included in the imaging device is formed of an organic substrate and an inorganic substrate, the organic substrate including an insulation layer that is made of an organic material, the inorganic substrate including an insulation layer that is made of an inorganic material. The imaging element included in the imaging device is bonded to the substrate. The connection portion included in the imaging device connects the substrate included in the imaging device and the imaging element included in the imaging device.

Imaging device and method for producing imaging device

A solid-state imaging unit includes: a solid-state imaging device mounted on a substrate; a bonding wire which electrically connects a pad formed on the solid-state imaging device and a lead formed on the substrate; a frame member having a frame shape which surrounds side portions of the solid-state imaging device; and an optical member having optical transparency and mounted on the frame member so as to face an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion which protrudes from an optical member side toward the imaging surface of the solid-state imaging device, and the frame member and the solid-state imaging device are integrally fixed to each other in a state where the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface.

Growing community of inventors

Kumamoto, Japan

Atsushi Yoshida