Panasonic Intellectual Property Management Co., Ltd.

Sekisui Chemical Co., Ltd.

Atsushi Wada

Yuki Kitai

Masashi Koda

Yasunori Hoshino

Mikio Sato

Juichi Fukatani

Takazumi Okabayashi

Kiyomi Uenomachi

Ryousuke Ebina

Ryusei Kozawa

Kozo Nakamura

Hiroyuki Nakatani

An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in a molecule.

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board

An aspect of the present application relates to a resin composition, which contains a polymer having a structural unit represented by Formula (1) in a molecule and a free radical compound and in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (2), (3), (4) and (5) in the molecule.

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

A copper clad laminate includes: an insulating layer containing a cured product of a resin composition; and a surface treated copper foil on one surface or both surfaces of the insulating layer, the resin composition containing a polymer, and the surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, the finely roughened particle treatment layer being formed of fine copper particles having a particle size of 40 to 200 nm, a heat resistance treatment layer containing nickel provided on the finely roughened particle treatment layer, a rust prevention treatment layer containing at least chromium provided on the heat resistance treatment layer, a silane coupling agent layer provided on the rust prevention treatment layer, and an amount of nickel attached in the heat resistance treatment layer being 30 to 60 mg/m.

Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil

An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B). In Formula (1), n represents 0 to 10, Z represents an arylene group, and Rto Reach independently represent a hydrogen atom or an alkyl group.

A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, Rto Reach independently represents a hydrogen atom or an alkyl group, and Rto Reach independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Prepreg, metal-clad laminate, and wiring board

A resin composition is provided containing a polymer having a structural unit represented by the following Formula (1) in the molecule, and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less. In Formula (1), Z represents an arylene group, Rto Reach independently represent a hydrogen atom or an alkyl group, and Rto Reach independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board

A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.

Copper-clad laminate plate, resin-attached copper foil, and circuit board using same

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G' at 200&#xb0; C. before irradiation with light of 8&#xd7;10Pa or lower and a storage modulus G&#x2032; at 200&#xb0; C. after irradiation with light of 8&#xd7;10Pa or higher, with the storage modulus G&#x2032; at 200&#xb0; C. after irradiation with light being higher than the storage modulus G&#x2032; at 200&#xb0; C. before irradiation with light.

Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet

The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.

Filling-bonding material, protective sheet-equipped filling-bonding material, laminated body, optical device, and protective panel for optical device

The present invention aims to provide an interlayer filling material for a touch panel which is used for filling an interlayer space between a touch panel and another component or an interlayer space between transparent conductive films included in the touch panel in production of a personal digital assistant, is less likely to cause cracks or breakage in a surface protection panel or a glass substrate, and enables production of a touch panel laminate that is not likely to display images with color irregularity. The present invention also aims to provide a touch panel laminate produced using the interlayer filling material for a touch panel. The present invention relates to an interlayer filling material for a touch panel used for filling an interlayer space between a touch panel and another component, or at least one of interlayer spaces included in the touch panel between transparent conductive films, between a glass sheet and one of the transparent conductive films, between a glass sheet and another glass sheet, between a glass sheet and a polarizing film, between a substrate and a glass sheet, between a substrate and one of the transparent conductive films, and between a substrate and a polarizing film, the interlayer filling material containing: a polyvinyl acetal; and a plasticizer, the interlayer filling material having a residual stress Kpa (25&#xb0; C., 2 min) after two minutes at 25&#xb0; C. of 300 kPa or less.

Growing community of inventors

Osaka, Japan

Atsushi Wada