Tel Sagami Limited

Tokyo Electron Sagami Limited

Atsushi Wada

Katsumi Ishii

Hirofumi Kitayama

According to this invention, a method of transferring a plurality of semiconductor wafers between a carrier and a support ring type boat comprises the steps of picking up the semiconductor wafer from the carrier on a station by an arm in a substantially horizontal state, positioning the wafer supported by the arm above a support ring of the boat, positioning a receiver below the support ring, moving the receiver upward to a position where a pin of the receiver reaches the arm through an opening of the support ring, lifting the wafer from the arm by the pin, moving the arm backward from the boat, moving the receiver downward to a position where the wafer is transferred from the receiver to the support ring, and then loading the boat into a heat treatment furnace.

Vertical heat treatment apparatus having wafer transfer mechanism and

Instrument for holding boats for thermal treatment of semiconductor

A horizontal/vertical conversion transporting apparatus, wherein a mechanism for variably changing a distance between upper and lower boat hands for clamping an article therebetween is mounted on a conversion arm, the conversion arm is vertically movable along a support arm, and at the same time, the conversion arm is rotatable within the plane of vertical movement.

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Chofu, Japan

Atsushi Wada