Ngk Spark Plug Company, Limited

Atsushi Uchida

Makoto Nagai

Masahito Morita

Hisashi Wakako

Yuma Otsuka

Kazunori Fukunaga

Kouhei Yoshimura

Kazuo Kimura

Setsuo Yada

A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.

Ceramic substrate, and method of manufacturing the same

A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction.

Ceramic substrate and method of manufacturing the same

A wiring board () having: a board body () including an insulating material and having a front surface (), a back surface (), a cavity () having an opening in the front surface () of the board body () and having a bottom surface () and a side surface (), and a projection which is provided on a front surface side of the side surface () of the cavity and projects toward a center of the opening; a metal layer () provided on the side surface () of the cavity; and an insulating portion which is provided on a back surface () of the projection () so as to define an obtuse angle (&#x3b8;) with the metal layer (), or which covers at least a top end portion of the metal layer ().

Wiring board

A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metalized layer provided along a side face of said cavity and metalized layers provided in said substrate body are provided to continue to each other.

Wiring substrate for mounting light emitting element

A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

Growing community of inventors

Kagamigahara, Japan

Atsushi Uchida