Nec Corporation

Tokyo Electron Limited

Atsushi Tsuboi

Shimpei Yamaguchi

Kiyotaka Imai

Atsushi Endo

Hiroshi Yano

Masaru Sugimoto

Masanobu Igeta

Yasushi Kodashima

A method of manufacturing a semiconductor device includes: forming a first film containing carbon over a silicon nitride film and a first conductive film; forming a first silicon oxide film surrounding the first film over the silicon nitride film and the first conductive film; removing the first film to form, in the first silicon oxide film, a first opening that exposes at least a part of the silicon nitride film and at least a part of the first conductive film; and forming a second conductive film on and in contact with the first conductive film in the first opening.

Method of manufacturing semiconductor device

A method for manufacturing a semiconductor device includes forming a support on a side surface of a stack that extends from a substrate. The stack includes a second sacrificial film, plural first sacrificial films and plural silicon (Si)-containing films, wherein one first sacrificial film of the plural sacrificial films is stacked upon the second sacrificial film and the plural sacrificial films and the plural Si-containing films are alternately stacked upon one another, and at least a side of the second sacrificial film is not covered by the support, the one first sacrificial film and the substrate. The method further includes removing the second sacrificial film from the stack to form a space between the substrate and the one first sacrificial film and adjacent to the support, and filling the space with a dielectric film.

Fabrication process flow of dielectric layer for isolation of nano-sheet devices on bulk silicon substrate

In a semiconductor device that includes a barrier film, an electrode pad on the barrier film, and a solder ball on the electrode pad, the electrode pad is prevented from exfoliating from the barrier film by a side wall film separating the solder ball from a boundary between the barrier film and the electrode pad.

Semiconductor device utilizing a side wall to prevent deterioration between electrode pad and barrier layer

First, a polysilicon film is formed on a gate oxide film. Next, a polysilicon oxide film is formed on the polysilicon film. Thereafter, the polysilicon film is thermally treated to allow a crystal grain in the polysilicon film to grow from the gate oxide film and the polysilicon oxide film. In a MOS type semiconductor device manufactured in this manner has a gate electrode formed of a plurality of laminated polycrystalline silicon layers each having substantially a single crystal grain in a thickness direction of the gate electrode.

MOS type semiconductor device and manufacturing method thereof

An underlying interconnection is formed on a semiconductor substrate, and an interlayer insulating film is formed on the semiconductor substrate and the underlying interconnection. A metal film is deposited on the interlayer insulating film, and is patterned in an interconnection pattern, and a first opening for connecting the metal film to the underlying interconnection is patterned, thereby forming an overlying interconnection. Then, a protection film is formed so as to cover the surfaces of the overlying interconnection and the interlayer insulating film. Next, a photoresist film is formed on the protection film, and is patterned to provide a second opening larger than the first opening in the protection film above the first opening and provide a third opening in a pad-portion forming region on the overlying interconnection. At the same time, with the overlying interconnection as a mask, the interlayer insulating film is selectively etched out to form a through hole. Then, a tungsten film is deposited in the through hole and on the protection film, and the unnecessary portion of the tungsten film is etched back to form a tungsten plug in the through hole which electrically connects the underlying interconnection to the overlying interconnection.

Growing community of inventors

Tokyo, Japan

Atsushi Tsuboi