Catalysts & Chemicals Industries Co., Ltd.

Other

Nippon Telegraph and Telephone Corporation

Atsushi Tonai

Michio Komatsu

Akira Nakashima

Katsuyuki Machida

Ryo Muraguchi

Hakaru Kyuragi

Kazuo Imai

Toshiharu Hirai

Tsuguo Koyanagi

Masayuki Matsuda

Michio Kimatsu

There is provided a process for producing an integrated circuit, wherein not only can conductive fine particles be deposited efficiently and densely in minute wiring channels and connecting holes but also a circuit of low wiring resistance and high density can be formed and wherein a high-degree integration can be achieved to thereby bring about an economic advantage. In particular, there is provided a process for producing an integrated circuit, comprising coating a substrate provided with wiring channels with a coating liquid for integrated circuit formation containing conductive fine particles to thereby form an integrated circuit on the substrate, wherein the coating liquid for integrated circuit formation while being exposed to ultrasonic waves is applied to the wiring channels.

Process for producing integrated circuit, and substrate with integrated circuit

A coating liquid for forming a silica-based film having a low dielectric constant, as low as 3 or less, comprising (i) silica-based fine particles having phenyl groups and (ii) a polysiloxazane which can be produced by reacting hydrolyzate of an alkoxysilane represented by the formula (X Si(OR ) )and/or hydrolyzate of a halogenated silane represented by the formula (X SiX&prime; ) with a polysilazane represented by &mdash;(SiR R &mdash;NR )&mdash; , or a coating-liquid for forming the silica-based film, comprising (i) silica-based fine particles having phenyl groups and (ii&prime;) an oxidatively decomposable resin with the weight ratio of the particles to the resin being in the range of 0.5 to 5.

Coating liquid for forming a silica-containing film with a low-dielectric constant and substrate coated with such a film

The present invention provides a method of easily planarizing the uneven surface of a substrate having an uneven surface. This method comprises the steps of forming a coating film containing spherical fine particles on a surface of a smooth substrate; sticking the surface of the smooth substrate provided with the coating film containing spherical fine particles to the uneven surface of a substrate having an uneven surface; and transferring the coating film containing spherical fine particles to the uneven surface of the substrate so that the uneven surface is planarized.

Substrate flattening method and film-coated substrate made thereby

Disclosed is a thin film-forming apparatus comprising a coating liquid feed means 6 for feeding a thin film-forming coating liquid onto a surface of a transfer roll 2, a transfer means 4 including the transfer roll 2 a surface of which is coated with the thin film-forming coating liquid fed from the coating liquid feed means to form a transfer thin film 8, and a substrate conveying means 16 for continuously conveying a substrate 9 under the transfer roll, a surface of said substrate 9 to be provided with a thin film, wherein the transfer means is so fabricated that the transfer roll surface having the transfer thin film thereon is closely contacted with the surface of the substrate conveyed by the substrate conveying means, to transfer the transfer thin film formed on the transfer roll surface to the substrate surface. Also disclosed is a thin film-forming method using the thin film-forming apparatus. By the apparatus and the method, formation of a planar thin film on a substrate such as a semiconductor wafer can be carried out continuously, stably and at a low cost, and quality lowering of the thin film and property change thereof with time caused by adherence of impurities to the thin film or contamination of the thin film with impurities are avoidable. Moreover, the apparatus and the method are applicable to large-sized substrates.

Thin film-forming method and thin film-forming apparatus therefor

Growing community of inventors

Kitakyushu, Japan

Atsushi Tonai