Dow Corning Corporation

Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Atsushi Togashi

Yoshitsugu Morita

Randall Gene Schmidt

David Joseph Romenesko

Minoru Isshiki

Hiroji Enami

Hiroshi Ueki

Tomoko Kato

Gary Michael Wieber

Y Dow Corning Toray Silicone Co Ltd Morita

H Dow Corning Toray Silicone Co Ltd Ueki

M Dow Corning Toray Silicone Co Ltd Isshiki

A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [RSiO][RSiO][RSiO](where R, R, and Rare univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of Rare aryl groups; a+b+c equals 1; on average, 'a' satisfies the following condition: 0&#x2266;a&#x2266;0.8; on average, 'b' satisfies the following condition: 0.2&#x2266;b&#x2266;0.8; and, on average, &#x201c;c&#x201d; satisfies the following condition: 0.2&#x3c;c&#x3c;1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Curable silicone composition and cured product thereof

This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300.

Flame retardant compositions

A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Curable organopolysiloxane composition and a semiconductor device made with the use of this composition

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Midland, MI, United States of America

Atsushi Togashi