Canon Kabushiki Kaisha

Atsushi Teranishi

Yoshiyuki Nakagawa

Takuro Yamazaki

Masaya Uyama

Akiko Hammura

Kazuhiro Yamada

Toru Nakakubo

Osamu Kanome

Atsunori Terasaki

Yoshiyuki Fukumoto

Takeru Yasuda

Naoko Shimizu

Masahiko Kubota

Souta Takeuchi

Kazuaki Shibata

Ryoji Kanri

Taichi Yonemoto

Atsushi Hiramoto

A liquid ejection head includes: an ejection port array being an array of ejection ports; a plurality of pressure chambers corresponding respectively to the ejection ports and communicating with the ejection ports; individual supply channels and individual collection channels communicating with the pressure chambers; a common supply channel communicating with surfaces of the individual supply channels opposite to surfaces thereof communicating with the pressure chambers; a common collection channel communicating with surfaces of the individual collection channels opposite to surfaces thereof communicating with the pressure chambers; and a damper member forming a wall of a part of at least one of the common supply channel or the common collection channel. The common supply channel and the common collection channel are formed so as to extend in a first direction along the ejection port array, and are disposed side by side in a second direction crossing the ejection port array.

Liquid ejection head

A liquid ejection head includes a plurality of nozzles arranged along a first direction of an ejection surface, a plurality of pressure chambers communicating with the plurality of individual nozzles and provided with actuators configured to apply, to a liquid, pressures for ejecting the liquid from the nozzles, a plurality of discrete flow paths communicating with the plurality of individual pressure chambers, a common flow path communicating with the plurality of individual discrete flow paths via discrete opening portions and extending in the first direction, and a damper mechanism disposed to face the common flow path in a direction crossing the ejection surface to absorb a pressure fluctuation in the liquid in the common flow path. The common flow path is provided with a partition wall disposed between the discrete opening portions adjacent in the first direction to extend in the direction crossing the ejection surface.

A liquid ejection head and liquid ejection apparatus are capable of reducing or preventing a decrease in image quality without increasing the chip size. To achieve this, a configuration is employed in which a bonding layer is not provided between a liquid supply substrate and channel partitions between common supply channels and common collection channels, and a minute communication portion is provided there.

Liquid ejection head and liquid ejection apparatus

A liquid ejection head includes ejection orifices for ejecting liquid, common liquid chambers connected to the ejection orifices, common flow passages, and pitch conversion flow passages that connects the common flow passages and liquid chambers to each other. The pitch conversion flow passages includes a periphery formed with resin. In a case where a number of pitch conversion flow passages in a group is minimum on a condition that one or more of the pitch conversion flow passages are respectively included in the group, the pitch conversion flow passages have a repeating pattern in which the group is repeatedly arranged. At least one of two pitch conversion flow passages adjoining an m-th pitch conversion flow passage (m is all integers from 1 to n−2, where n is an integer of 3 or more) is one of first to (m+1)-th pitch conversion flow passages.

Liquid ejection head and manufacturing method of liquid ejection head

A method for producing a substrate that includes a protective layer made from a metal oxide protecting silicon against corrosion and an organic resin layer on a substrate surface of a silicon substrate includes the following steps in this order: step A of forming the protective layer on the substrate surface; step B of removing the protective layer from the substrate surface in a region Zthat is a part of the region in which the protective layer has been formed; and step C of providing an organic resin layer on the substrate surface in a region Zincluding the region Z

Method for producing substrate, substrate, and liquid ejection head

Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Method of forming film on substrate and method of manufacturing liquid ejection head

A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

Liquid ejection head and a manufacturing method of the same

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

Method for forming film and method for manufacturing inkjet print head

A method for forming a patterned film on a substrate includes: step of patterning a mask material on the substrate, thereby covering, with the mask material, the region except a patterned film forming region on a substrate surface on which the patterned film is to be formed; step of covering, with a protective member, at least a part of the surface of the mask material opposite to the substrate so as to allow the patterned film forming region to communicate with outside air, thereby forming a workpiece to be subjected to film formation in following step; step of forming a film on at least the patterned film forming region of the surface of the workpiece communicating with the outside air; step of releasing the protective member from the mask material; and step of removing the mask material and a part of the film on the mask material.

Method for forming patterned film and method for producing liquid ejection head

A liquid ejection head includes: a substrate including an energy-generating element; a flow path forming member including a discharge port and having a liquid flow path formed between the flow path forming member and the substrate; and a plurality of through-passages passing through the substrate, each of the through-passages including a first through-passage part serving as a common liquid chamber and a plurality of second through-passage parts communicating with the first through-passage part, wherein a separation wall separating the adjacent first through-passage parts includes a plate-shaped member separating the adjacent first through-passage parts and approximately vertical to a substrate in-plane direction and, at least one protrusion protruding from the plate-shaped member in the substrate in-plane direction and contacting a bottom portion of the first through-passage part.

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Kawasaki, Japan

Atsushi Teranishi