Brother Kogyo Kabushiki-Kaisha

Hamamatsu-Photonics K.k.

Tokai National Higher Education and Research System

National University Corporation Tokai National Higher Education and Research System

Atsushi Tanaka

Hiroshi Amano

Yasunori Igasaki

Daisuke Kawaguchi

Chiaki Sasaoka

Yotaro Wani

Toshiki Yui

Takayuki Tsuji

There is provided a laser processing method for cutting a semiconductor object along a virtual plane facing a surface of the semiconductor object in the semiconductor object. The laser processing method includes a first step of forming a plurality of first modified spots along the virtual plane to obtain first formation density, by causing laser light to enter into the semiconductor object from the surface, and a second step of forming a plurality of second modified spots along the virtual plane so as to obtain second formation density higher than the first formation density, by causing laser light to enter into the semiconductor object from the surface after the first step.

Laser processing method, semiconductor member manufacturing method, and laser processing device

There is provided a laser processing method for cutting a semiconductor object along a virtual plane facing a surface of the semiconductor object in the semiconductor object. The laser processing method includes a first step of forming a plurality of first modified spots along the virtual plane by causing laser light to enter into the semiconductor object from the surface, and a second step of forming a plurality of second modified spots along the virtual plane so as not to overlap the plurality of first modified spots, by causing laser light to enter into the semiconductor object from the surface.

An electronic device, comprising: an execution unit which executes a predetermined function; a first control unit that has an input terminal and causes the execution unit to execute the predetermined function; a power source unit that supplies power at least to the first control unit; and a second control unit that has an output terminal connected to the input terminal of the first control unit via a signal line, operates to output a signal to the first control unit via the signal line, and causes the power source unit to cut off power supply to the first control unit, and wherein the second control unit keeps a potential of the signal line at a reference level lower than or equal to a predetermined threshold while the second control unit causes the power source unit to cut off power supply to the first control unit.

Preventing flow of current from sub-CPU to main-CPU during power saving mode in an image forming apparatus

A motor controller is provided. The motor controller includes a motor drive unit that drives a plurality of motors; a thermal shutdown unit that is provided in the motor drive unit and that stops the plurality of motors in the case of an overload; a lock signal generation unit that generates a lock signal corresponding to a respective one of the plurality of motors when a rotational speed of the respective motor reaches a threshold speed set for the respective motor; and an operation determination unit which, when the lock signal generation unit interrupts lock signals for all of the plurality of motors, determines that thermal shutdown unit has operated.

Growing community of inventors

Nagoya, Japan

Atsushi Tanaka