Canon Kabushiki Kaisha

Tdk Corporation

Mitsubishi Jidosha Kogyo Kabushiki Kaisha

Canon Anelva Corporation

Japan Display Inc.

Konami Digital Entertainment Co., Ltd.

Atsushi Takeda

Shinya Onodera

Takehisa Tamura

Yoshiyuki Komiya

Fumiteru Gomi

Kouichi Hashimoto

Ken Morita

Yuichi Nagai

Takashi Hasegawa

Akitoshi Yoshii

Hideki Yokoyama

Hideki Kaneko

Shinobu Arimoto

Norihisa Ando

Katsuyoshi Maeshima

Shizuo Hasegawa

Nobuaki Tsuchiya

Tatsunori Sato

Kazunari Sekiya

Tadashi Inoue

Hiroshi Sasamoto

Masaharu Tanabe

Akira Sato

Taisuke Ahiko

Masahiro Itoh

Hiroaki Tsuchiya

Toru Katsumi

Kazushige Ito

Kenichi Shibuya

Takayuki Moriwaki

Yoshio Uchikawa

Masayuki Okabe

Takaki Shinkawa

Shuichi Kadota

Masaaki Togashi

Kenichi Takeda

Kimio Nakahata

Takashi Hamano

Takashi Kamiya

Koji Amemiya

Takashi Suenaga

Michiro Koike

Hiroki Tamura

Yuji Kamiya

Yoshihiro Murasawa

Shirou Ootsuki

Masaki Shimizu

Kazuchika Tashima

Kenichi Matsumoto

Satoru Fukushima

Hironobu Saito

Kenichi Nakamori

Tatsuo Inagaki

Takanobu Takenaka

Koki Kimura

Yui Sugiura

Tomomichi Gunji

Toshiaki Isogai

Erika Nakamura

Hiroki Asayama

Hiromi Kikuchi

Hironobu Sato

Chiaki Nakanishi

Natsumi Kato

Takuma Nozaki

Toshiya Taji

Miki Kimura

Hiroshi Ohi

Masauki Okabe

Kouhei Yamaguchi

Masato Tojo

Kenji Misaki

Hitoshi Inada

Fumiaki Iwanaga

Kuoichi Hashimoto

Akitoshi Yoishii

Sachi Kazama

Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

Electronic component

According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.

Deposition device and deposition method

A plasma processing apparatus includes a balun having a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, and a ground electrode arranged in the vacuum container and grounded.

Plasma processing apparatus

A plasma processing apparatus includes an impedance matching circuit, a balun having a first unbalanced terminal connected to the impedance matching circuit, a grounded second unbalanced terminal, a first balanced terminal and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, an adjustment reactance configured to affect a relationship between a first voltage applied to the first electrode and a second voltage applied to the second electrode, a high-frequency power supply configured to supply a high frequency between the first unbalanced terminal and the second unbalanced terminal via the impedance matching circuit, and a controller configured to control an impedance of the impedance matching circuit and a reactance of the adjustment reactance.

Plasma processing apparatus, plasma processing method, and memory medium

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.

An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T(&#x3bc;m) and a minimum thickness of the second region is T(&#x3bc;m), the maximum thickness Tand the minimum thickness Tsatisfy a relation of2/1&#x2265;0.26.

A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T(&#x3bc;m) and a maximum thickness of the second region is T(&#x3bc;m), the maximum thickness Tand the maximum thickness Tsatisfy a relation of2/1&#x2265;0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.

A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (&#x3bc;m) and a maximum thickness of the second region is T2 (&#x3bc;m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of2/1&#x2265;0.11.In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.

An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.

An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (&#x3bc;m), a maximum thickness of the second region is T2 (&#x3bc;m), and a minimum thickness of the third region is T3 (&#x3bc;m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of2/1&#x2265;0.11,and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of3/1&#x2265;0.11.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.

An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.

An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.

An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.

Growing community of inventors

Tokyo, Japan

Atsushi Takeda