Seiko Epson Corporation

Other

Atsushi Takakuwa

Takao Nishikawa

Satoshi Nebashi

Hiromu Miyazawa

Takeo Kawase

Masaya Ishida

Toshiaki Mikoshiba

Satoshi Shimokawato

Shoji Hoshina

Mutsumi Tamura

Hiroshi Kiguchi

Takayuki Kondo

Takamitsu Higuchi

Setsuya Iwashita

Jun Amako

Masahiro Furusawa

Sumio Utsunomiya

Tomoyuki Kamakura

Tatsuya Shimoda

Daisuke Sawaki

Noboru Furuya

Takashi Hashimoto

Tadaoki Mitani

Masaru Kojima

Hisato Yamaguchi

A liquid droplet ejecting head includes a fluid path forming substrate having a fluid path communicating with nozzle holes and a diaphragm on the fluid path forming substrate. The diaphragm has a first surface facing a second surface. A piezoelectric element on the first surface of the diaphragm has a piezoelectric body layer interposed between a first electrode and a second electrode. A support substrate on the first surface of the diaphragm has a space for containing the piezoelectric element. The support substrate includes a first member formed on the first surface of the diaphragm, and a second member formed on the first member. The first member has a first opening for containing the piezoelectric element. The space of the support substrate is defined by the first opening of the first member and the second member. The main material of the first member is resin.

Liquid droplet ejecting head, method for manufacturing the same, and liquid droplet ejecting apparatus

A piezoelectric element has a piezoelectric body, two electrodes sandwiching the piezoelectric body, a protective layer covering the piezoelectric body and the two electrodes, and an antistatic layer formed on and/or in the protective layer.

Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus

Aspects of the invention can provide a method for manufacturing a microstructure, including forming a photosensitive film above a work piece, exposing the photosensitive film, as a first exposure, by irradiating interference light generated by intersecting two laser beams having a wavelength shorter than a wavelength of visible light, developing the exposed photosensitive film so as to develop a shape corresponding to a pattern of the interference light to the photosensitive film, and etching the work piece using the developed photosensitive film as an etching mask.

Method for manufacturing a microstructure, exposure device, and electronic apparatus

A method for manufacturing an organic thin film element that includes an organic thin film between a pair of thin film electrodes and at least one electrode being a transparent electrode includes forming a transparent electrode by spraying a material liquid containing a transparent electrode formation material on a base material, and forming an organic thin film on the transparent electrode. This method allows for the manufacture of the organic thin film element by which an organic thin film element with high light-extraction efficiency is simply provided. A method for manufacturing an electro-optic device and a method for manufacturing electronic equipment that utilize the method for manufacturing an organic thin film element are described.

Method for manufacturing microlens and method for manufacturing organic electroluminescence element

A method for manufacturing an optical waveguide includes the steps of forming a liquid-repellent region upon a substrate, and forming the optical waveguide in a region upon the substrate other than the liquid-repellent region.

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Exemplary embodiments of the present invention provide a method of manufacturing a piezoelectric device that includes a piezoelectric layer having high crystallinity in which crystal orientation is aligned to a desired direction, a method of manufacturing a ferroelectric device that includes a ferroelectric layer having the similar high crystallinity, and so forth. Exemplary embodiments include an insulating layer composed of SiO2 and so forth and a buffer layer composed of strontium oxide (SrO) and so forth are formed on a substrate such as a silicon single crystal wafer in sequence, and then a lower electrode composed of strontium ruthenate (SRO) is formed on the buffer layer. By forming self-assembled monolayers on the lower electrode, high affinity regions Aand low affinity regions Aare formed. Then, piezoelectric layers are selectively formed only on the high affinity regions A

Method of manufacturing piezoelectric device

A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

Device manufacturing method

This ink jet recording head manufacturing method comprises (A) a process for forming a peeling layerwherein peeling is induced by light irradiation, on a base plateexhibiting light-transmissivity, (B) a process for forming a common electrode filmon the peeling layer, (C) a process for forming a plurality of piezoelectric elements, (D) a process for forming a reservoir piececomprising a lid structure that accommodates in its interior one or more piezoelectric elements, which interior forms an ink reservoir, (E) a process for irradiating the peeling layerwith prescribed light from the base plateside thereof, thereby producing peeling in the peeling layer, and peeling the base plateaway, and (F) a process for bonding a pressure chamber plate, whereon are provided a plurality of pressure chambers, to the common electrode filmseparated from the base plate, so that the pressure chambersare sealed. Heads compatible with high resolution can thus be manufactured because thin pressure chamber plates can be fabricated in a separate process from the piezoelectric element formation process and then, last of all, bonded in place.

Ink jet recording head

An ink jet recording head manufacturing method is provided comprising: forming a peeling layer wherein peeling is induced by light irradiation on a base plate exhibiting light-transmissivity; forming a common electrode film on the peeling layer; forming a plurality of piezoelectric elements, forming a reservoir piece including a lid structure that accommodates one or more piezoelectric elements in an interior which forms an ink reservoir; irradiating the peeling layer with prescribed light from the base plate side to induce peeling; peeling the base plate away; and bonding a pressure chamber plate provided with a plurality of pressure chambers to the common electrode film separated from the base plate so that the pressure chambers are sealed.

Manufacturing method for an ink jet recording head

A manufacturing method of a microlens array includes the step of forming second light transmitting layerson a first light transmitting layerThe first light transmitting layerhas a plurality of recessed partsand partitionsfor delimiting the recessed partswherein at least a portion of the inner surface of each recessed partis a lens surfaceThe second light transmitting layersare formed in the respective recessed partsin such a manner that the second light transmitting layersavoid the partitionsof the first light transmitting layerThe second light transmitting layersare formed in such a manner that the surfaces of the second light transmitting layersform lens surfacesfor the respective recessed parts

Microlens array, manufacturing method thereof and optical instrument

A method for fabricating a microlens array having a flat surface by a simple process, a microlens array fabricated, thereby and an optical device. The method for fabricating the microlens array includes a first step of bringing a lens side of a microlens array substrate having a plurality of lenses formed thereon into close contact with a flat surface of a master plate , in which one surface is the flat surface , with a light transmitting layer precursor therebetween; a second step of curing the light transmitting layer precursor to form a light transmitting layer ; and a third step of releasing the master plate from the light transmitting layer

Microlens array, method for fabricating the same and optical devices

A method for manufacturing a microlens array including the steps of forming a reflecting layer as a mark composed of at least one of a raised part and a recessed part in a first light-transmitting layer having a plurality of lenses and the mark, the reflecting layer having a higher reflectance than that of the first light-transmitting layer; and forming a second light-transmitting layer so as to cover at least the lenses.

Microlens array, manufacturing method thereof, optical device and electronic device with reflective alignment mark in lens layer

This ink jet recording head manufacturing method comprises (A) forming a peeling layer wherein peeling is induced by light irradiation, on a base plate exhibiting light-transmissivity, (B) forming a common electrode film on the peeling layer , (C) forming a plurality of piezoelectric elements , (D) forming a reservoir piece comprising a lid structure that accommodates in its interior one or more piezoelectric elements , which interior forms an ink reservoir , (E) irradiating the peeling layer with prescribed light from the base plate side thereof, thereby producing peeling in the peeling layer , and peeling the base plate away, and (F) bonding a pressure chamber plate , whereon are provided a plurality of pressure chambers , to the common electrode film separated from the base plate, so that the pressure chambers are sealed.

In order to manufacture, with high productivity, an information record carrier capable of recording information at a high density, in a method in which a curable resin is coated on a master (,) having a pattern corresponding to the required information, and the master and a substrate of the information record carrier are bonded to transfer the pattern on the master to the substrate of the information record carrier, a projection (,), a hole, a recess, or the like is provided on the surface of the master (,) so as to engage with the substrate of the information record carrier.

Method of manufacturing information record carrier

In order to realize a compact construction of an apparatus for producing an optical recording medium while shortening the time required for transporting a mold, there is provided an apparatus for producing an optical recording medium by curing a curable resin (,) between a substrate (,) and a mold (,), including: a mold fixing mechanism (,) for fixing the mold (,); a transporting mechanism (,) for transporting the substrate (,) to which the curable resin (,) has been applied to a position where the mold (,) is fixed, and placing the substrate (,) on the mold (,) such that the surface of said substrate to which the curable resin (,) has been applied faces the mold (,); a resin curing mechanism (,) for curing the curable resin (,) which has been sandwiched between the mold (,) and the substrate (,) by the action of the transporting mechanism (,); and a separating mechanism (,) for separating the resin (,) that has been cured by said resin curing mechanism (,), together with the substrate (,), from the mold (,).

Growing community of inventors

Shiojiri, Japan

Atsushi Takakuwa