Hitachi, Ltd.

Hitachi Tobu Semiconductor

Hitachi Eastern Semiconductor

Atsushi Sasayama

Tugio Nemoto

Kunio Aiki

Haruo Kugimiya

Makoto Haneda

Satoru Ishii

Tutomu Kawasaki

Yoshihiko Kobayashi

Yukio Takahashi

Tetsuo Kumazawa

Sakae Kikuchi

Shoichi Takahashi

Makoto Shimaoka

Norihiro Yazaki

Yasutoshi Yagiu

Hideo Taguchi

Ryuichi Ikezawa

Tsunetoshi Kawabata

Yuuji Kakegawa

Yasushi Takizawa

Masando Tozawa

In a transmitting and receiving optoelectronic device, a wave-separating filter (16) is disposed at a position deviated from 45.degree. with respect to the optical axis of transmission light (6), or the internal wall surface of a light passage hole (15A) of a support (15) is inclined with respect to the optical axis of the transmission light (5). In another arrangement, a light-transmitting optical unit (1) and a wave-separating optical unit (13) are provided as separate units, and optical-axis adjustment is performed with only the light-transmitting optical unit (1).

Optoelectronic device

An optical coupling apparatus including a light emitting diode, a lens, an optical isolator and an optical fiber disposed on a common optical axis is improved in the optical coupling efficiency. The individual optical elements are roughly adjusted in the respective positions and fixed, and then a precise and fine adjustment is effectuated by plastically deforming a portion of a holder for supporting the lens or the optical isolator and/or by adjusting inclination of the holder. The holder imparted with the fine adjustment capability can be implemented as a lens holder.

Optical coupling apparatus and manufacturing method of the same, and

In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation.

Method of mounting a light emitting chip and an optical fiber on a

In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation. Terminals are formed by leads having an inductance reducing thick portion that are connected to the photoelectric device inside a box-shaped housing. A thinner lead conforming to the prevailing standard connector is connected to the thick lead using ultrasonic bonding at a position outside of the housing.

Photoelectric device with leads

Photoelectric device with optical fiber and laser emitting chip

In the photo electro device, a laser diode chip is set fixedly through a submount to a heatsink in a package. In assembling, first a ball lens is anchored to a holder of a lens support frame by clinching claws of the holder. Subsequently the surfaces of the ball lens on the obverse and reverse sides of the lens support frame are coated with nonreflective films. Then the position of the lens support frame is adjusted relatively to the laser diode chip so that the respective optical axes are aligned with each other. And after an arm is welded fixedly to the heatsink, a frame member is severed or removed to complete the work for setting the ball lens.

Photo electro device, method for manufacture of same, and lens support

An optoelectronics device wherein a light-receiving element which defines a monitor light receiver and a semiconductor laser which generates a laser beam are hermetically sealed in the same package, and wherein the light-receiving surface of the element for measuring the output power of the beam of light emitted from the semiconductor laser is disposed so as to be inclined with respect to the light-emitting surface of the semiconductor laser. The wire bonding surface of the light-receiving element pellet-bonded to a stem and the wire bonding surface of the lead electrically connected to the light-receiving element through a wire are arranged so as to be parallel with each other. Thus, it is possible to support both the bonding surfaces horizontally at the same time. As a result, a bonding tool can be brought into perpendicular contact with each of the bonding surfaces, and this enables appropriate wire bonding to be effected.

Optoelectronics device

A luminescent device having a luminescent element, an optical fiber for taking up the light emitted from the luminescent element, and a package accommodating the illuminant element and receiving an end portion of the optical fiber. The optical fiber is fixed at a portion near the tip thereof by a first fixing material such that its optical coupling end opposes the light emitting region of the luminescent element, while the remainder part of the portion of the optical fiber in the package is surrounded and held by a second fixing material. By virtue of the second fixing, it is possible to avoid breakage or other defects of the fiber attributable to the difference in the thermal expansion coefficient between the core portion of the optical fiber made of quartz and a jacket of the optical fiber covering the core line portion, thus attaining a higher reliability of the illuminant device. The second fixing material also prevents water from coming into the package along the optical fiber, thereby ensuring a greater moisture-proof property of the device.

Luminescent package device for coupling an optical fiber with a

A semiconductor device is disclosed wherein a semiconductor pellet is attached on a heat sink of a flange, leads are connected to corresponding electrodes of the semiconductor pellet directly or through wires, the semiconductor pellet and portions of the leads are sealed by resin mold on the flange and top outer periphery of the heat sink is formed with a projection to prevent peel-off of the resin mold and cracking of the resin mold which would otherwise occur due to difference between coefficients of thermal expansion of the flange and the resin mold.

Resin sealed semiconductor device

Growing community of inventors

Komoro, Japan

Atsushi Sasayama