Showa Denko K.k.

Komatsu Corporation

Ricoh Company, Ltd.

Renesas Electronics Corporation

Fujitsu Corporation

Showa Denko Kabushiki Kaisha

Denka Company Limited

Yokohama National University

Nissan Motor Company Limited

Hitachi, Ltd.

Kao Corporation

Jfe Steel Corporation

National Institute for Materials Science

Semiconductor Technology Academic Research Center

Murata Manufacturing Co., Ltd.

Atsushi Sakai

Yuji Furuta

Ryuji Monden

Hideki Ohata

Katsuhiko Yamazaki

Koro Shirane

Hiroshi Konuma

Toru Sawaguchi

Hiroshi Nitoh

Shuichi Suzuki

Mitsuhiro Ryuman

Katsumi Eikyu

Yoshiaki Ikenoue

Masanori Minagawa

Yoshitaka Taniguchi

Toshihiro Okabe

Daisuke Tanaka

Koichiro Nakamura

Masanori Tojima

Tomonori Ozaki

Ikuo Katoh

Toshihiko Baba

Jun Nakagawa

Takashi Ichimura

Tadashi Nakamura

Masahiko Takenaka

Naoto Jikutani

Takayuki Hasebe

Tetsuya Nitta

Hideki Hirotsuru

Tsuyoshi Ueno

Yasufumi Yamada

Akiharu Nishijima

Nobunari Tsukamoto

Kenta Osagawa

Tsuyoshi Hashiguchi

Suzuya Yamada

Kazuma Izumiya

Toshiyuki Ikeoh

Kohki Ichikawa

Satoru Tokuda

Tatsuya Shiga

Yosuke Kadono

Kosuke Yoshida

Takahiro Mori

Isamu Yamada

Shinichi Shiotsu

Hiroyoshi Funato

Hiroki Fujii

Kouichi Yasaki

Satoshi Inano

Akira Itasaki

Hiroshi Yanagigawa

Hiroshi Ooki

Takashi Hiranaka

Koken Yamamoto

Akira Hasegawa

Yotaro Goto

Suguru Sangu

Ryuuen Kou

Akihiro Shimomura

Yusuke Ohta

Makoto Watanabe

Aya Suzuki

Natsuo Ishiwata

Shingo Maeda

Kennichi Kasuga

Hideko Ohata

Wataru Minamida

Kenji Ishii

Tatsuo Obata

Koichi Nushiro

Kentaro Nakayama

Kazuhiko Tsukamoto

Hajime Oguma

Kouji Morita

Yuji Kobashi

Seiji Kuroda

Hideharu Amano

Kaori Kojima

Teruto Ohta

Hiroshi Araki

Yusuke Maeda

Hiroyuki Arie

Ryuuji Umemoto

Masayuki Yanagihashi

Naoki Kawamura

Yuta Nabuchi

Yudai Ogawa

Yasuchika Matsui

Masaya Yumiba

Youko Nobuhara

Hiroyuki Hiroha

Takanao Ochiai

Hideki Central Research Laboratory Showa Ohata

Koro Central Research Laboratory Showa Shirane

A haul vehicle management system includes: a three-dimensional data acquisition unit that acquires three-dimensional data outside an outline of a traveling area where a haul vehicle can travel; and a course data generation unit that generates a traveling course of the haul vehicle on the basis of outer shape data of the haul vehicle and the three-dimensional data, the traveling course being set in the traveling area.

Haul vehicle management system and haul vehicle management method

A semiconductor device includes a cell region in which a plurality of unit cells are formed, and an outer peripheral region surrounding the cell region in plan view. Each of the plurality of unit cells includes a semiconductor substrate having a drift region, a body region, a source region, a pair of first column regions, and a gate electrode formed in a trench with a gate insulating film interposed therebetween. A well region is formed on a surface of the drift region in the outer peripheral region. A second column region is formed in the drift region below the well region and extends in Y and X directions so as to surround the cell region. The well region is connected to the body region, and the second column region is connected to the well region.

Semiconductor device and method of manufacturing the same

A work machine control system includes: a position sensor detecting a position of a work machine traveling on a traveling path; first and second non-contact sensors provided in the work machine and detecting a position of an object around the work machine; a map data creation unit creating map data based on detection data of the position sensor and detection data of the first non-contact sensor; a first position calculation unit calculating a first position of the work machine by matching the map data and the detection data of the first non-contact sensor; a second position calculation unit calculating a second position of the work machine based on detection data of the second non-contact sensor; and an integrated position determination unit determining an integrated position of the work machine by integrating the first and second positions.

Work machine control system, work machine, and work machine control method

A semiconductor device includes a semiconductor substrate, a first source region and a first drain region each formed from an upper surface of the semiconductor substrate, a first gate electrode formed on the semiconductor substrate between the first source region and the first drain region via a first gate dielectric film, a first trench formed in the upper surface of the semiconductor substrate between the first gate dielectric film and the first drain region in a gate length direction, a second trench formed in the upper surface of the semiconductor substrate between the gate dielectric film and the first drain region in the gate length direction, the second trench being shallower than the first trench, and a first dielectric film embedded in the first trench and the second trench. The first trench and the second trench are in contact with each other in a gate width direction.

Semiconductor device

A management system includes a course data generation unit that generates course data for each of a plurality of unmanned vehicles such that loading work for the plurality of unmanned vehicles by a loader is sequentially performed on a work site where a plurality of the loaders operates; and a priority determination unit that determine a passage order at an intersection on the work site of the plurality of unmanned vehicles traveling according to the course data so as to reduce a total loading loss indicating a total of loss amounts in operation of each of the plurality of the loaders.

Work site management system and work site management method

A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

Composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing same

An optical device includes a light source provided with a plurality of surface-emitting laser elements to emit a laser beam, a scanner to scan the laser beam emitted from the light source, and an optical system disposed in an optical path between the light source and the scanner and to guide the laser beam to the scanner. The optical system includes a first optical element to control a divergence angle of the laser beam emitted from the light source and a second optical element to concentrate the laser beam that has passed through the first optical element onto a to-be-scanned surface of the scanner.

Optical device, range sensor using optical device, and mobile object

A distance measuring apparatus includes a light source to emit light beams, an optical scanner to scan the light beams output from the light source over a predetermined range, a light receiver to receive reflected light obtained as a result of the light beams being reflected by a target object, and to output detection signals, and a control circuit to measure a distance to the target object based on the detection signals. The light source including a plurality of light-emitting device groups that are arranged in a scan direction of a scan performed by the optical scanner, and the control circuit being to make the plurality of light-emitting device groups emit light at respective different timings in a single scan, and to measure the distance to the target object based on a sum of the detection signals.

Distance measuring apparatus and mobile body including the same

An optical device includes: a substrate having a first surface, and a second surface opposite of the first surface; a plurality of surface emitting laser elements provided on the first surface of the substrate and configured to emit light in a direction intersecting the first surface; a plurality of optical elements disposed on the second surface so as to respectively correspond to the plurality of surface emitting laser elements; and an anti-reflection structure between the substrate and the plurality of optical elements.

Optical device, lighting apparatus, measuring apparatus, part-inspecting apparatus, robot, electronic device, and movable object

A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

Method for manufacturing aluminum circuit board

A semiconductor device according to an embodiment comprises: a cell portion in which a vertical type MOSFET is formed; and a termination portion arranged adjacent to the cell portion. The termination portion includes a connection trench gate provided along a first direction. The cell portion includes: a plurality of first column regions provided along a second direction intersecting the first direction; and a plurality of trench gates provided along the second direction such that two trench gates are arranged between the two adjacent first column regions. The plurality of trench gates extend from the cell portion to the termination portion and are connected to the connection trench gate. The plurality of first column regions extend from the cell portion to the termination portion, and the termination portion includes a plurality of second column regions different from the plurality of first column regions.

A work machine management system includes: a position detecting device that detects a position of a work machine traveling in a workplace; a non-contact sensor that detects an object existing in the workplace in a non-contact manner; map data that accumulates information on existence and a position of the object existing in the workplace on the basis of detection data obtained by the position detecting device and detection data obtained by the non-contact sensor; a travel route generation unit that generates a travel route where the work machine travels; and an identifying unit that identifies perfection of map data. The travel route generation unit generates the travel route where the work machine travels on the basis of the perfection of the map data identified by the identifying unit.

Work machine management system and work machine

A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10&#xb0; C. to 270&#xb0; C. and then ejected from the nozzleand a gauge pressure of the inert gas at an inlet of the nozzleis from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.

Method for producing ceramic circuit board

A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value &#x3b1;1 of a linear thermal expansion coefficient at 25&#xb0; C. to 150&#xb0; C. is 5&#xd7;10to 9&#xd7;10/K, a ratio &#x3b1;1/&#x3b1;2 of the &#x3b1;1 to a theoretical value &#x3b1;2 of the linear thermal expansion coefficient at 25&#xb0; C. to 150&#xb0; C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

Ceramic circuit board

A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient &#x3b1;1 (&#xd7;10/K) of the base plate and a linear thermal expansion coefficient &#x3b1;2 (&#xd7;10/K) of the ceramic insulating substrate when a temperature decreases in the range of 25&#xb0; C. to 150&#xb0; C. satisfy the following Expression (1). 

Power module

Growing community of inventors

Tokyo, Japan

Atsushi Sakai