Sanyo Electric Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Atsushi Saita

Tetsuro Sawai

Toshikazu Imaoka

Hiroshi Kanno

Yukihiro Yoshimine

Tasuku Ishiguro

Shigeharu Taira

Haruhisa Hashimoto

Takeshi Yamaguchi

Yasunori Inoue

Yasufumi Tsunomura

Akimichi Maekawa

Shigeyuki Okamoto

Toshiyuki Sakuma

Makoto Tsubonoya

Shintaro Saiki

Yukako Sakuragi

A stacked body is obtained by stacking a glass plate, a transparent resin sheet, a solar cell, a colored resin sheet, and a first resin sheet in the order. The stacked body is pressed under heat to fabricate the solar cell module. The module includes the glass plate, a transparent sealing layer placed between the glass plate and the solar cell and formed of the transparent resin sheet, a colored sealing layer placed between the first resin sheet and the solar cell and formed of the colored resin sheet, and the first resin sheet. One of the transparent resin sheet and the colored resin sheet has a tan &#x3b4; of 1 or higher at a temperature of the pressing, and the other one of the transparent resin sheet and the colored resin sheet has a tan &#x3b4; of less than 1 at the temperature of the pressing.

Method of manufacturing solar cell module and solar cell module

A solar cell module includes: solar cells each having a first main surface and a second main surface; a front-side transparent protective member disposed on a first main surface-side of the solar cells; a front-side transparent encapsulant layer disposed between the front-side transparent protective member and the solar cells; a back-side protective member disposed on a second main surface-side of the solar cells; a back-side white encapsulant layer disposed between the back-side protective member and the solar cells; and a back-side transparent encapsulant layer disposed between the back-side white encapsulant layer and the solar cells, wherein a thickness of the back-side transparent encapsulant layer in a vicinity of an edge portion of the second main surface of the solar cells is less than a thickness of the back-side transparent encapsulant layer in a region between the solar cells that are neighboring to each other.

Solar cell module

The present invention provides a solar cell module which keeps backing film from being scratched and prevents the occurrence of scratches. The solar cell module () of the present invention is provided with a surface protecting member (), backing film (), a plurality of solar cells () arranged between the surface protecting member () and the backing film () and electrically connected by means of wiring members (), a filler material () for sealing the solar cells () between the surface protecting member () and the backing film (), and transition wiring () electrically connected with the wiring members (). Here, at least the end portion of transition wiring () positioned in a corner portion of the solar cell module is arranged so as to be positioned closer to the surface protecting member () than other portions of the transition wiring ().

Solar cell module and manufacturing method therefor

In a solar cell module, the wiring memberis connected onto the connection electrodethrough a resin adhesive; and the connection electrodeincludes a plurality of projectionswhich are in direct contact with the wiring member.

In the solar cell module, the resin adhesiveincludes a plurality of removed portionson the principal surface of the photoelectric conversion partby removing the resin adhesivein a vertical direction. The plurality of removed portionsare formed in the row in cross directions K.

Solar cell module and method of manufacturing the same

A solar cell module includes a protective body, a sheet facing the protective body, a filler layer provided between the protective body and the sheet, and a solar cell disposed inside the filler layer. The filler layer has a first filler layer and a second filler layer. The first filler layer is provided in contact with the sheet. The first filler layer is formed of a resin. The second filler layer is formed of a resin whose gel fraction is higher than 0% and is less than a gel fraction of the resin of the first filler layer.

With the method for manufacturing the solar cell moduleaccording to the present embodiment, the width Wof the connection region C in which the wiring memberand the connecting electrodeare electrically connected is set to be larger than the substantially half of the width Wof the wiring memberin the thermocompression bonding process of the wiring memberusing the resin adhesiveincluding the particlesonto the principal surface of the solar cell

Solar cell module and method for manufacturing the same

A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: a bridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.

Circuit substrate structure and circuit apparatus

The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.

Circuit device

A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third conductor embedded in the dielectric material layer. In the wiring board, a thickness of the dielectric material layer in a first region located between the third conductor and the first conductor is larger than a thickness of the dielectric material layer in a second region located between the third conductor and the second conductor. Moreover, a cross-sectional shape of the third conductor is trapezoidal in which angles of respective ends of the third conductor on a side closer to the second conductor are obtuse.

Growing community of inventors

Kobe, Japan

Atsushi Saita