Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Atsushi Murasawa

Ken Tsuzuki

Takashi Goh

Motohaya Ishii

Hiroshi Terui

Yoshiyuki Doi

Fumihiro Ebisawa

Tomoyo Shibazaki

Takao Fukumitsu

Yuichi Kikuchi

Masahiro Yanagisawa

Yusuke Nasu

Takashi Saida

Shinji Mino

Takashi Yamada

Hiroshi Yamazaki

Shunichi Soma

Kazunori Seno

Naoki Ooba

Masayuki Okuno

Yasuaki Hashizume

Mitsuru Nagano

Keiichi Morita

Takanori Ishikawa

Hiroki Kawashiri

Masahiko Naito

Yoshiteru Jinnouchi

A light shielding structure of an optical circuit of the present invention uses a part of the structure of the light reception element itself to suppress stray light. A stepped electrode that covers an upper surface and side surface of a first semiconductor layer constituting a light absorption portion of the light reception element is formed at a height substantially equal to that of an optical waveguide in the optical circuit, and the light absorption portion of the light reception element is shielded from stray light by a wall-shaped or column-shaped wiring electrode extending substantially perpendicularly to a surface layer of the optical circuit. The light shielding structure of the present invention uses a part of the configuration of the light reception element, is formed integrally with the light reception element, and also has an aspect of the invention of the light reception element.

Light reception element and light shielding structure for optical circuit

In an optical component, a part of a waveguide type optical device is fixed to a convex portion of a mount. The optical component includes an optical device support base, a pressure member and a pressure support base. The optical device support base is interposed between the mount and the presser member enough to be slidable in a direction parallel to surfaces of the mount and the presser member.

Optical component

In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component () comprises an optical device chip () including an LN waveguide (), a first PLC waveguide (), a second PLC waveguide (), and a fiber alignment member (), a mount (), and optical fibers (). Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as an tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.

Excess optical power in a waveguide device is appropriately terminated. According to one embodiment of the present invention, the waveguide device comprises a termination structure filled with a light blocking material for terminating light from the end section of a waveguide. This termination structure can be formed by forming a groove on an optical waveguide by removing the clad and core, and filling the inside of that groove with a material attenuating the intensity of the light (light blocking material). In this manner, light that enters into the termination structure is attenuated by the light blocking material, and influence on other optical devices as a crosstalk component can be suppressed. With such termination structure, not only the influence on optical devices integrated on the same substrate, but also the influence on other optical devices directly connected to that substrate can be suppressed.

Waveguide device and module

Growing community of inventors

Yokohama, Japan

Atsushi Murasawa