Nippon Soda Co., Ltd.

Hitachi, Ltd.

Atsushi Mori

Motoyo Wajima

Mineo Kawamoto

Kanji Murakami

Mamoru Aizawa

Hiroo Muramoto

Masayuki Kataoka

Takao Morikawa

Tosio Kobayasi

Hideo Tsuda

Kiyoshi Ozaki

Masayuchi Sato

Surface treating agents comprising of an organic titanium compound containing at least one fluoropolyether radical linked by carboxy groups to the titanium and at least one hydrolyzable group, such compounds being obtained by reacting a fluoropolyether having one or more carboxylic groups with a titanium compound having at least one group able to react with carboxylic group and at least one residual hydrolyzable group per titanium atom. The surface treating agents have not only superior surface activity and anti-corrosion properties for the metal surface but are also chemically stable.

Surface treating agent and the process therefor

A photo-curable resist resin composition for electroless plating comprising an epoxy resin having a viscosity of at least 150 poises at 25.degree. C., and at least two glycidyl ether groups in one molecule, the glycidyl ether groups being directly bonded to the aromatic ring as Component A, an oxirane ring-containing compound having a boiling point of at least 140.degree. C. and a molecular weight of not more than 500 as Component B, and a photo-sensitive aromatic onium salt as Component C, wherein the Component A is in an amount of 90 to 40 parts by weight per total 100 parts by weight of the Components A and B, and the Component C is in an amount of 0.1 to 5 parts by weight per total 100 parts by weight of the Components A and B, and, if any, other resin components, can produce a resist film capable of withstanding highly alkaline electroless copper plating solution at a high temperature for a long time without any decrease in the physical properties of plating films deposited even by repeated use of the electroless copper plating solution. The resist film prepared from the resist resin composition has distinguished soldering heat resistance, solvent resistance and electrical insulation.

Photo-curable resist resin composition for electroless plating, process

A photo-curable resin composition which comprises mixing urethane-acrylate resin [I], which is obtained by reacting components A and B, i.e.,

Photo-curable urethane-acrylate resin composition for permanent resist

A flexible polybutadiene resin composition having 100 parts of (a), 5 to 120 parts of (b), and 50 to 500 parts of (c), where

Flexible polybutadiene resin composition having excellent electrical

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Chiba, Japan

Atsushi Mori