Tokyo Ohka Kogyo Co., Ltd.

Atsushi Miyanari

Yoshihiro Inao

Akihiko Nakamura

Koichi Misumi

Takahiro Asai

Yasumasa Iwata

Ken Miyagi

Koji Saito

Hirofumi Imai

Koki Tamura

Shigeru Kato

Takahiro Yoshioka

Junichi Katsuragawa

Shingo Ishida

Tatsuhiro Mitake

Satoshi Ohya

Kosuke Doi

Takahiro Setaka

A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

Bonding method and bonding apparatus

A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.

Retention device and retention method

A cleaning device for cleaning a substrate adhering to a support film, including a protective film forming measure for forming a protective film on an exposed surface of the support film, wherein the exposed surface is a portion of a surface of the support film to which a first surface of the substrate adheres, but the substrate does not adheres to the exposed surface; and a cleaning measure for cleaning the substrate by use of a cleaning liquid, the substrate adhering to the support film covered with the protective film. The cleaning device can effectively clean a wafer supported by a dicing tape.

Cleaning device, cleaning method, and composition

An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.

Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate

Provided is a method including the steps of: carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a storage space section into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in the storage space section; and carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, in the step for carrying out the rotation process, the processing jig being moved along a direction which is not a direction along which the process-target object is being rotated.

Method for processing process-target object

To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

Perforated support plate

The present invention relates to a processing apparatus for fluid-processing a process target body. The processing apparatus is configured to have: supply means for supplying a fluid; process target body processing means for processing the process target body by causing a fluid supplied from the supply means to come into contact with a process target body while preventing the fluid from being scattered; recovery means for recovering the fluid supplied to the process target body processing means; and support means for supporting the process target body processing means so as to not come into contact with the process target body.

Processing apparatus fluid-processing a process target body

In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.

Liquid solvent abutment unit

An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.

Adhesive composition and adhesive film

A bonding unit () bonding a wafer () and a support plate () with a mediation of an adhesive agent () to form a bonded substance (), and a plasma treatment unit () treating the bonded substance () with a plasma treatment are provided.

Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method

The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.

Adhesive composition and film adhesive

A separating device according to the present invention separates a support plate () from a substrate () of a laminate () including the substrate () and the support plate () bonded to each other. The separating device includes: a first storing section () for storing the laminate (); a plurality of first processing sections () for reducing adhesive force of an adhesive () applied between the substrate () and the support plate (); and a first carrying section () which is capable of moving in the first direction and carries the laminate () from the first storing section () to the first processing section () while holding the laminate (). With the first carrying section (), it is possible to provide a separating device () which moves straightly so as to carry the laminate (). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.

Separating device

A wafer can be thinned without occurrences of dimples. A support platehas a number of through holes. A circuit forming surface of a waferis adhered to one surface of the support plate by an adhesive member, and a dimple prevention memberhaving a thickness of 100 &#x3bc;m or more and having an adhesive layeron one face is adhered to the other surface, thus the openings at both ends of the through holesare blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.

Method of thinning wafer and support plate

An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200&#xb0; C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.

Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

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Kawasaki, Japan

Atsushi Miyanari