Hitachi Chemical Company, Ltd.

Atsushi Kuwano

Itsuo Watanabe

Motohiro Arifuku

Tohru Fujinawa

Houko Kanazawa

Seiji Tai

Naoki Fukutomi

Hidehiro Nakamura

Yoshiaki Tsubomatsu

Hajime Nakayama

Nobuaki Takane

Tomoo Nishiyama

Kouichi Kaitou

Masahiko Itabashi

Naoki Hara

Masanori Nakamura

Mitsuo Yamada

Jun Taketatsu

Kazumasa Fukuda

Shinsuke Hagiwara

Hideyuki Katagi

Toshiaki Shirasaka

Yasuhiko Awano

Shigemitsu Yoshie

Yasuo Miyazaki

Kensuke Yoshihara

Tohru c/o Goshomiya Works Fujinawa

Itsuo c/o Goshomiya Works Watanabe

Motohiro c/o Goshomiya Works Arifuku

Houko c/o Research & Developement Center Kanazawa

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 &#x3bc;m and less than 1 &#x3bc;m, not less than 1 &#x3bc;m and less than 10 &#x3bc;m, from 10 &#x3bc;m to 50 &#x3bc;m, and from 20 &#x3bc;m to 100 &#x3bc;m, and in which a peak present in a range of from 10 &#x3bc;m to 50 &#x3bc;m includes an aluminum oxide particle, and a peak present in a range of from 20 &#x3bc;m to 100 &#x3bc;m includes a boron nitride particle. In Formula (I) each of R, Rand Rindependently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 &#x3bc;m to less than 1 &#x3bc;m, from 1 &#x3bc;m to less than 10 &#x3bc;m, and from 10 &#x3bc;m to 100 &#x3bc;m, and the filler contains boron nitride particles having particle sizes of from 10 &#x3bc;m to 100 &#x3bc;m. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Circuit-connecting material and circuit terminal connected structure and connecting method

A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.

A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40&#xb0; C. or above and a 1-minute half-life temperature of 180&#xb0; C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Circuit connecting material, and structure and method of connecting circuit terminal

The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.

Process for the fabrication of wiring board for electrical tests

The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin

A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.

Wiring board for electrical tests with bumps having polymeric coating

An information recording medium has a recording layer which comprises a composition containing:

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Tsukuba, Japan

Atsushi Kuwano