Tomoegawa Paper Co., Inc.

Chisso Corporation

Atsushi Koshimura

Yukinori Sakumoto

Shigeyuki Yokoyama

Akihiro Shibuya

Hitoshi Narushima

Yoshikazu Tsukamoto

Tadahiro Oishi

Masaki Tsushima

Nobumasa Ohtake

Takeshi Shima

Nobuyuki Nakayama

Tamio Kimura

Fuminori Aikawa

Kazuhiro Takayanagi

Masayuki Tsuchida

Hiroshi Matsushita

An adhesive tape for electronic parts, comprising

Adhesive tapes

An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising

This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.

Adhesive tapes for tape automated bonding

Resin compositions for the inner coat of semiconductors which include

Resin composition for inner coat of semiconductor chip

Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed.

Adhesive tapes and semiconductor devices

Disclosed is wrapped glass cap article, comprising at least one glass cap and a pair of plastic films having located therein the at least one glass cap, at least one of the pair of plastic films being imparted on its inner surface with a weak adhesiveness so that the glass cap is tightly sealed due to the weak adhesiveness of the plastic film. The article gives rise to glass caps with less contamination when the plastic film is peeled off.

Wrapped glass cap article

An adhesive tape for die bonding is disclosed, comprising a release film having a release layer on at least one side of a support and an adhesive layer attached to said release layer, wherein the exposed surface of said adhesive layer is a mirror-like surface having an average roughness on center line (Ra) of not more than 2.5 .mu.m and a maximal height (Rmax) of not more than 20 .mu.m.

Adhesive tapes for die bonding

An adhesive tape for die bonding is disclosed, comprising a continuous tape wound on a reel, the continuous tape having a structure that an adhesive layer composed mainly of a filler and a binder comprised of an epoxy resin and a polyester resin is laminated on a release film. According to the adhesive tape for die bonding of the invention, bonding of semiconductor elements can be attained with good workability and high reliability by very easily handling of the adhesive tape.

Growing community of inventors

Shizuoka, Japan

Atsushi Koshimura