Hoya Corporation

Texas Instruments Corporation

Atsushi Komoro

Tadashi Minakuchi

Noriko Ota

Yousuke Ikemoto

Tomokazu Yamashita

Toshiki Watanabe

Toshio Tachibana

Yoichi Hitokata

An imaging module includes: an image sensor; and a mounting board on which the image sensor is mounted together with a plurality of passive components. The mounting board includes: a first surface on which the image sensor is surface-mounted; a second surface that is located on an opposite side to the first surface and on which the passive component is mounted; a third surface that is continuous with the second surface via a step and on which the passive component is mounted; and a columnar cable connection block that rises from the second and third surfaces and to which a cable is connected.

Imaging module and endoscope having image sensor and mounting board

An endoscope includes an objective lens provided at a distal end portion of an insertion portion, an image sensor in which a light receiving area is formed on a surface facing the objective lens, and a drive circuit substrate that is disposed on a back side of the image sensor and includes a drive circuit to drive the image sensor, the endoscope further including an electromagnetic shield that houses the image sensor and the drive circuit substrate, in which the electromagnetic shield includes: a first shield member including a cylinder that covers a side portion of the image sensor, a structure that is disposed between the image sensor and the objective lens and that has an opening that allows entrance of light from the objective lens, and a wiring pattern that is formed on an inner peripheral surface of the cylinder and the structure.

Endoscope having electromagnetic shield

An image processing apparatus has an image data obtaining means configured to obtain image data acquired by photographing biological tissue, a score calculating means configured to calculate a score representing severity degree of lesion of the biological tissue photographed in an image represented by the image data for each pixel based on the image data, a reliability evaluation means configured to evaluate reliability of the score based on the image data, and a score reliability calculating means configured to calculate score reliability which represents a ratio of pixels of which scores having predetermined reliability to all the pixels of the image data.

Image processing apparatus

Provided is a correction data generation method that includes acquiring captured image data by imaging an indicator that is related to a predetermined illness; plotting a real imaging data point that corresponds to the acquired captured image data in a predetermined color space that is associated with the predetermined illness in accordance with a color component of the data point; calculating a correction value for correcting the values of pixels that make up a captured image captured by an electronic endoscope based on the distance between the data point and a predetermined target point in the predetermined color space; and storing the calculated correction value.

Correction data generation method and correction data generation apparatus

An image processing apparatus has a color image obtaining means configured obtain color image data representing a color image of biographic tissues, a lesion determining means configured to determine whether each pixel of the color image is of a lesion part based on the color image data, and a marking means configured to apply a mark indicating a position of the lesion part on the color image based on a result of determination, and the mark is configured such that the color image at a background of the mark can be seen.

A microminiature CCD image pickup device with a shortened length that can be applied to an electronic medical endoscope or the like. Microminiature CCD image pickup device () has optical glass (), CCD chip (), and stacked circuit board () that are disposed in that order along its length orientation. It further has TAB tape () that connects CCD chip () and the electronic circuits mounted on stacked circuit board (). Stacked circuit board () is formed with insulated circuit board in which are packaged electronic circuits, including their wiring pattern, stacked in stacked layers in the diametral direction perpendicular to said length orientation, and has at least one cavity () formed as an indention in the diametral direction. At least one miniature chip component () is mounted in cavity (), and at least one chip component () is mounted on the surface of stacked circuit board () over cavity (). The electronic circuits are stacked in stacked circuit board () and chip components () and () are disposed in the diametral direction, so that the length of microminiature CCD image pickup device () is shortened.

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Ibaraki, Japan

Atsushi Komoro