Kelk Ltd.

Other

Tokyo Seimitsu Co., Ltd.

Sika Corporation

Toho Chemical Industry Co., Ltd.

Atsushi Kobayashi

Wataru Omuro

Akira Ikeda

Jun Imamura

Tetsu Tomoyose

Wernher M Danzinger

Daisuke Goto

Takenori Takahashi

Kaname Saitoh

Seiichi Koshisaka

Toshihiko Amaya

Kaname Saito

Hirofumi Bandoh

Takashi Motoyama

A substrate support device includes a placement part formed in a plate shape which extends in a horizontal direction and having a placement surface on which a substrate is placed, and a movable part which makes the placement surface conform to the substrate by moving according to a warpage of the substrate placed on the placement surface. The movable part includes an arm part including an expansion and contraction part which expands and contracts in the horizontal direction according to the warpage of the substrate placed on the placement surface, an arm body having a longitudinal direction in a vertical direction in a state in which the substrate is not placed on the placement surface, and an arm connection part which connects a lower end of the arm body to an outer end of the expansion and contraction part in the horizontal direction.

Substrate support device

A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.

Temperature control device for semiconductor wafer and temperature control method for semiconductor wafer

A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.

Processing liquid temperature control apparatus

A substrate processing apparatus includes a chamber which has a processing room in which a substrate is processed, a cover which is provided in the processing room and is provided between the substrate and the chamber, and a heater which is provided only on the cover among the chamber and the cover and heats the cover.

Substrate processing apparatus

A superior cement dispersant and a concrete composition containing the cement dispersant, the cement dispersant being a water-soluble amphoteric copolymer which contains an alkylene oxide adduct of a polyamide polyamine having an unsaturated group and at least two types of polyalkylene glycol ester. When the cement dispersant is compounded with a concrete composition, the dispersion performance thereof increases with time, and the concrete viscosity is effectively decreased. The cement dispersant composition contains a water-soluble amphoteric copolymer or the neutralized salt thereof as an essential component, which is obtained by copolymerizing an alkylene oxide adduct of a polyamide polyamine having an unsaturated group, (meta)acrylic acid or an alkali metal, ammonium, or alkanolamine salt thereof, an ester of an alkylene glycol and methacrylic acid, and an ester of an alkylene glycol and acrylic acid. In addition, the concrete composition containing the above cement dispersant is also disclosed.

Cement dispersant and concrete composition containing the dispersant

A cement dispersant (especially a dispersant for concretes with ultrahigh performance) comprising as a main component a water-soluble amphoteric copolymer obtained by copolymerizing (A) a polyamide-polyamine of an alkylene oxide adduct thereof with (B) (meth)acrylic acid or an alkali metal, ammonium, or alkanolamine salt thereof and (C) a polyalkylene glycol ester of (meth)acrylic acid in an A/B/C ratio of (10-40)/(10-40)/(50-80) (wt. %); and a concrete composition (especially an ultral high-performance concrete) containing the dispersant. The dispersant satisfies all of a water-reducing effect, slump flow retention, strength development, etc.

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Hiratsuka, Japan

Atsushi Kobayashi