Kabushiki Kaisha Toshiba

Shibaura Mechatronics Corporation

Shibaura Engineering Works Co., Ltd.

Atsushi Kinase

Masaaki Furuya

Masahiro Abe

Hiroshi Koizumi

Konosuke Hayashi

Yuji Nagashima

Takashi Ootagaki

Haruhiko Ishihara

Taketo Shiba

Tsuyoshi Sato

Nobuo Kobayashi

Yukihisa Hasegawa

Hidehito Azumano

Fujio Terai

Yasushi Ooishi

Hisataka Komatsu

Masataka Yokoi

Kimio Kogure

A gas leak detecting device of a heater pipe and a gas leak detecting method of a heater pipe, which are able to reliably detect a leak of gas from a heater pipe in which a fine hole is formed. A gas leak detecting device of a heater pipe, which is provided with an inside pipe housing a heater element and an outside pipe sealed surrounding the inside pipe and which is adjusted by a pressure adjustment mechanism in gas pressure in a space between the outside pipe and the inside pipe to a predetermined pressure value. The gas leak detecting device includes a gas flow resistance part, a pressure detection unit, and a leak judging device that judges whether gas is leaking from the heater pipe based on a detected pressure value obtained by the pressure detection unit.

Heater pipe gas leak detecting device and heater pipe gas leak detecting method

A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.

Substrate processing device and substrate processing method

A substrate processing deviceincludes a cleaning liquid supply unitsupplying a cleaning liquid to a surface of a substrate W, a solvent supply unitsupplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unitheating the substrate W supplied with the volatile solvent, and a drying unitdrying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit, and the heating unitand the drying unitare arranged in a course of transportation of the substrate W transported from the solvent supply unit

In a substrate processing devicehaving a heating and drying unitfor drying a surface of a substrate W, the heating and drying unitheats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.

Provided is a droplet jetting applicator including: a droplet jetting head configured to jet liquid supplied from a liquid storage unit; a liquid supply unit configured to supply the liquid from the liquid storage unit to the droplet jetting head through a liquid supply channel; a first buffer liquid reservoir positioned closer to the droplet jetting head than the liquid supply unit in the liquid supply channel, and formed so that the inflow liquid drops thereinto; a liquid return unit configured to return the liquid from the droplet jetting head to one of the liquid storage unit and the first buffer liquid reservoir through a liquid return channel; and a second buffer liquid reservoir positioned closer to the droplet jetting head than the liquid return unit in the liquid return channel, and formed so that the inflow liquid drops thereinto.

Droplet jetting applicator and method for manufacturing coated body

An ink jet applicator includes an ink jet head having nozzle via which liquid droplets are jetted, a seal mechanism sealing the nozzle using a pressure vessel; a solution supply mechanism supplying a solution to the nozzle at a predetermined pressure.

Ink jet applicator

A droplet jetting applicator includes a coating unit jetting and coating droplets to a to-be-coated object; a storage space storing the to-be-coated object coated with the droplets; an exhaust section exhausting gas in the storage space; an adjustment unit adjusting an outlet flow of the gas exhausted by the exhaust section from the storage space; and a control section controlling the adjustment unit so that the outlet flow is changed in a stepwise manner.

A droplet jetting applicator includes: a droplet jetting head which freely moves and includes a nozzle surface with a plurality of nozzles formed, from which droplets are jetted; a suction section which sucks the droplets jetted by the droplet jetting head from a facing position facing the nozzle surface; a support/transfer section which supports the suction section, freely moves together with the droplet jetting head, and moves the supported suction section to the facing position and a non-facing position which is apart from the facing position; and an exhaust section which evacuates the suction section to give the suction section a suction force.

Droplet jetting applicator and method of manufacturing coated body

An ink jet application method employed in an ink jet application device so as to apply a certain voltage to an actuator mounted to a nozzle and spray an ink-droplet from the nozzle by a uniform volume, including reading characteristic information for relating a volume of the ink-droplet to a voltage value to be applied to the actuator; calculating a voltage value related to the volume of the ink-droplet sprayed from the nozzle which is a voltage correcting object with reference to the characteristic information; calculating a voltage difference value between the calculated voltage value and a voltage value related to a specific voltage to the voltage difference value to the actuator mounted to the nozzle which is the voltage correcting object.

Ink jet application device and ink jet application method

A robot apparatus has a rotatable arm member. A stationary pulley is arranged in the center of the arm member, while a pair of rotatable pulleys are arranged at the respective ends of the arm member. A pair of fingers, used for conveying a work, are attached to the respective rotatable pulleys. A driving force transmission member is engaged with the stationary pulley and the rotatable pulleys. When the arm member is rotated, the driving force transmitting means rotates the rotatable pulleys in accordance with the outer diameter ratio of the stationary pulley to the rotatable pulleys.

Robot apparatus and treating apparatus

A control processing device moves an X-/Y-/Z-axis movement mechanism, a first rotation mechanism, and a second rotation mechanism. Consequently, a shock-wave oscillating device is moved in X-, Y- and Z-directions, so that the direction of radiation of shock waves can be changed while the focal point of the shock waves is being set at a target of treatment.

Growing community of inventors

Yokohama, Japan

Atsushi Kinase