Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Renesas Technology Corp.

Hitachi Metals, Ltd.

Hitachi High-tech Corporation

Hitachi Astemo Ltd.

Atsushi Kazama

Asao Nishimura

Hideo Miura

Akihiro Yaguchi

Ryoji Okada

Takanori Aono

Junji Onozuka

Yasuhiro Itou

Toshiya Satoh

Masahiko Ogino

Ichiro Anjo

Yoshihide Yamaguchi

Hidenori Shinohara

Shohei Hata

Hiroyuki Tenmei

Kazuyuki Fukuda

Kengo Suzuki

Masaya Horino

Hiroshi Onuki

Tadanori Segawa

Yosuke Horie

Kenichi Takeuchi

Masayuki Hio

Hiroaki Nagai

Miho Tobita

Makoto Kitano

Yasuhiro Yoshimura

Tatsuya Nagata

Naoki Matsushima

Takamichi Mori

Masato Ishizawa

Satoru Yamamoto

Toshiya Shiramatsu

Seiichi Katou

Tetsuji Kawahara

Kisho Ashida

Hanae Shimokawa

Hiroyuki Ota

Tadaaki Ishikawa

Takashi Fujimura

Masakatsu Saitoh

Kohei Nonaka

Takeshi Terasaki

Jiro Hashizume

Eiji Sakamoto

Kentarou Miyajima

Atsuo Soma

Isao Sakaguchi

Toshiki Kida

Yoshiaki Takada

Takuto Yamaguchi

Hiroyuki Oota

Tetsurou Kawai

Mieko Ishii

Keisuke Masuda

Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container.

Automatic analyzer

An ultrasonic cleaner includes: a cleaning tank; an ultrasonic transducer; a vibration head which extends from the ultrasonic transducer toward the cleaning tank and of which a tip portion includes a cylindrical hole having a longitudinal direction aligned to a vertical direction; and an air layer or a metallic member that is provided in an area formed by projecting at least the vibration head in the vertical direction under the cleaning tank, wherein the ultrasonic transducer is driven at a frequency at which the vibration head is vibrated resonantly in a vibration mode accompanied by a deformation in the longitudinal direction of the cylindrical hole and a direction perpendicular to the longitudinal direction, wherein an area formed by projecting at least the vibration head in the vertical direction in a bottom portion of the cleaning tank is formed of a material mainly including resin.

Ultrasonic cleaner and automatic analyzer using the same

The present invention provides a highly reliable stereo camera in which it is possible to prevent the heat generated by an image processing element from contributing to an increase in the temperature of an image sensor, even if the stereo camera is made more compact and the heat density is thus increased inside the stereo camera. The present invention includes: a pair of image sensorsthat have respective imaging elements disposed at the same height with a space therebetween; image processing elementsthat are disposed between the image sensors and process image signals captured by the image sensors; a casingthat has the image processing elements and the image sensors incorporated therein, and in the area between the image sensors, has an inclined surface that is inclined from the image sensorsdownward toward the imaging direction of the image sensors; an airflow paththat is defined so as to extend along the inclined surface of the casingtoward the imaging direction; and heat dissipating partsthat are thermally connected to the respective image processing elementsand disposed on the inclined surface so as to face the airflow path.

Stereo camera

The present invention provides a stereo camera capable of mitigating thermal stress generated between members and reducing measurement error. In the present invention, a housing is provided with a high-rigidity support part and low-rigidity support part for supporting a circuit board, a high-rigidity support area including the high-rigidity support part, and a low-rigidity support area including the low-rigidity support part. The high-rigidity support part has greater rigidity in relation to force acting in a baseline direction (X-axis direction) following a baseline length of a pair of camera modules than the low-rigidity support part. The high-rigidity support area is provided in one location so as to be adjacent to the low-rigidity support area in the baseline direction.

Supporting housing for stereo camera and circuit board

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Mechanical quantity measuring device and sensor unit

In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed. The pressure sensor is a pressure sensor obtained by arranging, on a diaphragm having a long side and a short side, a sensor chip in which four strain gauges having the same characteristic and constituting a bridge circuit are provided, the pressure sensor being for detecting, in the bridge circuit, voltage output that is in proportion to a pressure applied to the diaphragm, and the pressure sensor is configured as follows: the four strain gauges are arranged to be adjacent to one another in the vicinity of the center of the diaphragm so that two strain gauges are arranged along the short side and the other two strain gauges are arranged along the long side; and the diaphragm has a thin portion in a long-side direction seen from the sensor chip.

Pressure sensor

There is provided a pressure sensor which includes: a diaphragm having an inside surface facing to a fluid-tight space, the diaphragm including a diaphragm film that is part of the inside surface and deformable in response to a pressure application, and a diaphragm film support that is part of the inside surface and constitutes a periphery of the diaphragm film; a strain sensor bonded to the inside surface so as to lie partially on the periphery and having plural strain gauges thereon; and a depression formed on the inside surface, when defining an x-direction oriented from center of the inside surface to a position bonded of the strain sensor and a y-direction perpendicular to the x-direction on the inside surface, the depression extending a certain length in the y-direction, the depression being adjacent to or a certain distance apart from an edge of the strain sensor in the y-direction.

Pressure sensor, and mass flow meter, and mass flow controller using same

An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Pressure sensor having strain gauges disposed on a diaphragm

An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.

Acceleration sensor

A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.

Semiconductor strain sensor

Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.

Semiconductor sensor device and method for manufacturing same

A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

Functional device package with metallization arrangement for improved bondability of two substrates

A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.

Multi-chip module

The present invention is a semiconductor device having the semiconductor element obtained by cutting a semiconductor wafer with the electrode pad formed on one side along a scribe line, a semiconductor element protective layer on the semiconductor element which has a opening on the pad, a stress cushioning layer on the layer which has the opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and the conductor protective layer on the layers, the layer and the conductor protective layer forming the respective end faces on the end surface of the semiconductor element inside the scribe line and exposing the range from the end face of the end surface to the inside of the scribe line.

Semiconductor device and manufacturing method thereof

A display apparatus is disclosed with a vacuum seal member which has a shell structure. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.

Display apparatus with shell-structured vacuum seal

Growing community of inventors

Chiyoda, Japan

Atsushi Kazama