Denso Corporation

Atsushi Kashiwazaki

Yuki Sanada

Haruki Matsuzaki

Shinya Uchibori

Toshihiro Nakamura

Yasumitsu Tanaka

Shotaro Miyawaki

Takashi Yoshimizu

Koutarou Tanaka

Kosuke Suzuki

Katsuhiko Kawashima

A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.

Electronic device

An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.

Electronic device and method for manufacturing the electronic device

An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.

A vehicle control system for an automatic transmission includes a range selector for outputting a range instruction signal representing the selected shift range and a range shifter for manually outputting a shift instruction signal, and a by-wire control part for controlling the change-over of the shift range according to the range instruction signal input from the range selector. The by-wire control part has a range control circuit, which uses the shift instruction signal input from the range shifter if the range instruction signal is abnormal while monitoring the range instruction signal input from the range selector.

Vehicle control system

In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of the electrically-conductive adhesive is lower than that of the circuit board. The electrically-conductive adhesive is covered by an adhesion improving member. When peeling stress is applied to the circuit board from the molding resin, the electrically-conductive adhesive and the adhesion improving member receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board is reduced.

Electronic control device

An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.

Electronic controller

An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible portions are folded by 180&#xb0; to dispose respective rigid portions to be parallel to each other. The rigid portions, positioned at both ends of the circuit substrate, mount connectors so as to face to mutually opposed directions. Other rigid portions mount electronic components and heater components. The outermost connectors are connected to different connection objects. The casing is made of a metal material so that heat generating from the heater components can be transmitted via heat dissipation gel to the casing and efficiently released to the outside.

A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provided through the insulation layer of the outermost surface layer is formed. A bump is inserted in the through-hole to a bump allocating position of the semiconductor chip to be mounted in the insulation layer of the outermost surface layer. A portion of the wire in the wiring layer of the outermost surface layer is projected to the internal side of through-hole at the aperture of the through-hole.

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

A bump is formed on a bonding pad provided on a substrate. A passivation film covering a bonding pad provided on a semiconductor chip is provided with two apertures in which bumps are formed. The bump provided on the substrate advances and enters into a clearance between these bumps provided on the semiconductor chip when the semiconductor chip is packaged with the substrate.

Growing community of inventors

Anjo, Japan

Atsushi Kashiwazaki