Kabushiki Kaisha Toshiba

Jx Nippon Oil Energy Corporation

Osaka University

Eneos Corporation

Jxtg Nippon Oil & Energy Corporation

Atsushi Kameyama

Takashi Suzuki

Ryuichi Ueno

Takashi Morikita

Junko Ichihara

Shunro Yamaguchi

Shohei Takata

Hisashi Sone

Tsuneaki Fuse

Masako Yoshida

Masami Nagaoka

Katsue Kawakyu

Takashi Seki

Toshiki Seshita

Kazunori Ohuchi

Tadahiro Sasaki

Yoshiko Ikeda

Hiroaki Suzuki

Mayumi Morizuka

Kazuya Nishihori

Hirotsugu Wakimoto

Yoshiaki Kitaura

Takeshi Koike

Michael H Sitko

Sunil Konanki

Kenta Ue

Isao Ishikura

The invention provides a method for producing an epoxy compound by hydrogen peroxide using an organic compound having a carbon-carbon double bond as a raw material, wherein a by-product is suppressed from being generated and the epoxy compound is produced in a high yield. In particular, the invention provides a method for producing an epoxy compound involving oxidizing a carbon-carbon double bond in an organic compound with hydrogen peroxide in the presence of a catalyst, wherein the catalyst comprises a tungsten compound; a phosphoric acid, a phosphonic acid or salts thereof; and an onium salt having an alkyl sulfate ion represented by formula (I) as an anion: wherein Ris a linear or branched aliphatic hydrocarbon group having 1 to 18 carbons, which may be substituted with 1 to 3 phenyl groups.

Method for producing epoxy compound

The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance.  (In the Formula (1), Rto Rare each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).

Epoxy compound, curable composition containing the same, and cured product obtained by curing curable composition

The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), Rto Rare each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)

Epoxy compound, curable composition, cured product, method of producing epoxy compound, and reactive diluent

The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CRR; B represents CRR; Rto Reach independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)

Curable composition and cured product obtained by curing the same

The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 60% or more; and wherein the maximum peak is present within the range of retention time of from 27.6 to 28.0 minutes. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), Rto Rare each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.)

A method for producing an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of the compound having a carbon-carbon double bond, aqueous hydrogen peroxide, a powder of a solid catalyst support and a powder of a solid catalyst, wherein the solid catalyst comprises an isopolyacid, and the isopolyacid is produced from a catalyst raw material comprising (a) tungstic acid or a salt thereof and (b) at least one selected from the group consisting of a salt of an alkaline earth metal and a cationic polymer.

Production method for epoxy compound using solid catalyst

A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0&#xd7;10or less. [In the formula, R, R, R, R, R, R, R, R, R, R, R, and Reach independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].

Resin composition, hardened coating films therefrom, and photosemiconductor device using same

The present invention provides a method for producing an epoxy compound by expoxidation of an olefin compound with good productivity wherein a compound having a carbon-carbon double bond is reacted with hydrogen peroxide in the coexistence of (a) a compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support and (d) a powdered catalyst and optionally (e) an organic solvent, the total mass of (c) and (d) being 100 percent by mass or less on the basis of the total mass of (a), (b) and (e).

In order to produce an epoxy compound with a less chlorine content at a higher reaction rate and yield, the present invention provides a method for producing an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of the compound having a carbon-carbon double bond, the hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together, the solid catalyst comprising isopolyacids produced from (a) tungstic acid or a salt thereof and (b) a quaternary ammonium salt compound and/or a pyridinium salt, selected from halogen-free compounds.

The present invention provides a method for producing an alicyclic diepoxy compound at a higher yield by carrying out epoxidation of an alicyclic olefin compound at a higher reaction rate. The method is a method for producing an alicyclic diepoxy compound represented by formula (1) below by reacting an alicyclic olefin compound represented by formula (2) below with hydrogen peroxide in the coexistence of the alicyclic olefin compound represented by formula (2) below, a hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together: wherein Rto Rare each hydrogen, halogen, an alkyl group optionally having halogen or an alkoxy group optionally having a substituent.

Method for producing alicyclic diepoxy compound

A method is provided for carrying out epoxidation of an olefin compound with good productivity. The method produces an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide by carrying out repeatedly or continuously the following steps: (1) reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of (a) the compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support, and (d) a powdered solid catalyst, and optionally further (e) an organic solvent to produce an epoxy compound; (2) separating the epoxy compound reaction product from the reaction mixture produced in (1); and (3) adding (d) and also adding (a), (b), (c), and optionally further (e) to the mixture of the powdered solid catalyst support and powdered solid catalyst after separating the reaction product in (2).

Systems and methods for the noise analysis of circuits are presented. These systems and methods may allow a circuit or circuit design to be analyzed for possible noise failures in a block of logic caused by sources. outside the block. More particularly, these systems and methods may generate an abstract file for one or more blocks of a circuit. These abstract files may include noise tolerances for input pins and bi-directional pins of a block, along with noise tolerances for those output pins of the block which also feed to an input of one or more gates internal to the block. Using these noise abstracts a unit of the circuit may be analyzed, or the circuit itself may be analyzed for possible noise induced failures.

System and method for circuit noise analysis

An integrated circuit has first and second logic circuits having common input terminals and the same complementary logic function. The first logic circuit has a p-type FET circuit block and an n-type FET circuit block each with a high threshold value, while the second logic circuit has a p-type FET circuit block and an n-type FET circuit block each with a low threshold value. An output switch circuit intervenes between the p-type FET and n-type FET circuit blocks in each logic circuit and controls the power supply connection to each logic circuit. In operation, the output of the second logic circuit is connected to the output terminal to realize a low power consumption. In the standby state, the output of the first logic circuit is connected to the output terminal to realize a low leakage current.

Semiconductor integrated circuit

A level converter circuit includes two p-channel MOSFETs and two n-channel MOSFETs of gate-grounded type which receive complementary signals from a logic circuit, p-channel cross-coupled FETs, and n-channel cross-coupled FETs. The two FETs constructing each cross-coupled FETs can be driven by complementary inputs by supplying an output of the logic circuit operated on a low voltage and a logically inverted output thereof to each cross-coupled FETs via the gate-grounded FETs, and as a result, the gain characteristic of the cross-coupled FETs can be enhanced. The level converter circuit with low power consumption which has large tolerance for the element characteristic and converts a logic level which is as low as approximately 0.5V to approximately 1V to 3V which is a normal logic level.

Level converter circuit

A semiconductor integrated circuit has a logic circuit operated at a small power supply voltage of about 0.5V, wherein a noise margin of the logic circuit can be set at a larger value even if characteristics of the circuit vary depending upon manufacturing process conditions. Satisfactory speed can be ensured during an operation and power consumption can be reduced during a stand-by time. This is attained by controlling individual potentials of first and second conductivity type wells in which a logic circuit is formed. For this purpose, two voltage supply circuits for controlling voltages of the wells and a logic threshold voltage generator are provided.

Growing community of inventors

Tokyo, Japan

Atsushi Kameyama